PACKAGING AND INTERCONNECTION ELECTRONIC NEWSLETTER
The Packaging and Interconnections Electronic Newsletter sponsored by the IEEE
Components, Packaging, and Manufacturing Technology Society
(IEEE CPMT). The University Relations Committee of the MCM Division
of the Electronic Industries Assoication (EIA) is an affiliate of the
newsletter.
The editor of this newsletter is:
Stuart K. Tewksbury
s.tewksbury@ieee.org or skt@msrc.wvu.edu
Send newsitems and subscription requests (full, summary only, or table of
contents only) to pkg_news@msrc.wvu.edu.
Full copies as well as summaries and tables of contents of this and earlier
newsletters are available by ftp or gopher to msrc.wvu.edu (157.182.197.50).
- Volume 1(1), May 1994: text only
- Volume 1(2), June 1994: text only
- Volume 1(3), August 1994: text only
- Volume 1(4), October 1994: text only
- Volume 2(1), January 1995
- Volume 2(2), March 1995
- Volume 2(3), April 1995
- Volume 2(4), June 1995
- Volume 2(5), September 1995
- Volume 2(6), November 1995
- Volume 2(7), December 1995
- Volume 3(1), February 1996
- Volume 3(2), May 1996
- Volume 3(3), July 1996
- Volume 3(4), November 1996
Other Sites of Interest
- Mid-Atlantic Technology Applications Center. This NASA Regional Technology Transfer Center is organizing a techniacl briefing for a set of patented technologies for producing adhesiveless flexible, multilayer circuits. Details are at site give.
- IEEE CPMT Home Page.
- IEEE CPMT Publications.
- The Computer-Aided Life-Cycle CALCE
Electronic Packaging Research Center (EPRC) at the University
of Maryland focuses on the development of techiques necessary for the design,
construction, and integration of reliable and cost-effective electronics
packaging. The Center currently is funded by the University of Maryland,
the National Science Foundation, the State of Maryland, and 29 industrial
and federal members.
- The Integrated Electronics Engineering Center (IEEC) at the State University of New York at Binghamton.
- Die Information Exchange
(DIE) Industry Group.
- MCM Interconnect Designer's Access Service (MIDAS). The ARPA-sponsored MIDAS foundry access service at
USC/ISI interfaces system designers to domestic multichip module foundries.
Similar to MOSIS, the integrated circuits prototyping service, MIDAS provides
access to low cost prototype quantities of MCMs. Additionally, users can
share tooling and manufacturing costs through the use of standard module
sizes and packages.
- NIST Materials Theory Center: Solder Interconnect Design Group.
- EMAN Mailbase
List (Forum for discussion related to manufacture of electronic
products.
- Nanotechnology.
- Synrad Site.
TOPICS: CO2 laser marking systems for ic packages and pcb's.
Includes full catalog pages and descriptions of a range of CO2
lasers and laser marking systems for electronic components.
Submitted by Lou Herrick .
- TIMA Site.
TOPICS: Wide range of VLSI design, CAD, MCM, MEMS, etc. in this
major European site. For futher information, contact
Bernard Courtois (Bernard.Courtois@imag.fr, Tel: (+33)76574615, Fax:
(+33)76473814)
TIMA-CMP
46 avenue Felix Viallet, 38031 Grenoble Cedex,
France.
- Delft University Research Program Site.
TOPICS: Optical interconnections, neural processing for this Delft University
research program. Submitted by: Edward E. E. Frietman
(ed@cp.tn.tudelft.nl, Tel: (+31) 15 2781411, Fax: (+31) 15 2786740)
Faculty of Applied Physics, Delft University of Technology, Lorentzweg 1, 2628
CJ, Delft, The Netherlands.
The CPMT electronic newsletter Home Page is managed and edited from
the Microelectronic Systems Research Center at
West Virginia University. Please forward all input and questions to Stuart
Tewskbury, at skt@msrc.wvu.edu or to pkg_news@msrc.wvu.edu.