*****************************************************************************
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**                                                                         **
********** IEEE Components, Packaging, and Manufacturing Technology *********
**                                                                         **
*****************************************************************************
**        PACKAGING AND INTERCONNECTION ELECTRONIC NEWSLETTER              **
**                              (FULL)                                     **
**                         Volume 1, Number 2                              **
**                            June 24, 1994                                **
**                                                                         **
*****************************************************************************
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The Packaging and Interconnections Electronic Newsletter has
been established as a vehicle for rapid and broad dissemination
of information in the general area of interconnections and 
packaging (both electrical and optical) for both electronic
and optical systems.  The newsletter is sponsored by the IEEE
Components, Packaging, and Manufacturing Technology Society
(IEEE CPMT).  The University Relations Committee of the MCM Division
of the Electronic Industries Assoication (EIA) is an affiliate of the
newsletter.

The editor of this newsletter is
        Stuart K. Tewksbury
        Microelectronic Systems Research Center
        Dept. Electrical and Computer Engineering
        Eng. Science Bldg. 827
        West Virginia University
        Morgantown, WV 26506
        Tel: (304)293-6371  ext 512
        Fax: (304)293-7486
        Email: s.tewksbury@ieee.org


*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
*******************        Table of Contents        *************************
*****************************************************************************
*****************************************************************************
 
1: RESOURCES

   1.1  The ARPA (ASEM) MCM Brokerage Service
   1.2  Video Training for Printed Wiring Board Fabrication and Assembly
   1.3  Signal Integrity Mailing List
   1.4  Fast, Crosstalk-Driven MCM Router

2: CALENDAR OF CONFERENCES/MEETINGS

   2.1  IEEE MULTI-CHIP MODULE CONFERENCE
           (February 1 - 2, 1995, The Cocoanut Grove, Santa Cruz, CA) 
           Abstract Submission Deadline: AUGUST 12, 1994 
   2.2  OPTICAL FIBER COMMUNICATION CONFERENCE - OFC '95: CALL FOR PAPERS
           (Abstract/Summary Deadline: Received by Sept. 13, 1994)
   2.3  3rd TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING
           (Nov. 2-4, 1994, Monteray, CA)
   2.4  1st INTERNATIONAL SYMPOSIUM ON MICROELECTRONIC PACKAGING AND
           PCB TECHNOLOGY (Sept. 19-23, 1994; Hosted by Tsinghua Univ.,
           Beijng, China)
   2.5  16th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM
           (Sept. 11-14, 1994, Hyatt Regency La Jolla, San Diego, CA)
            CALL FOR PAPERS, Due date: June 15, 1994
   2.6  SURFACE MOUNT INTERNATIONAL: Conference and Exposition
          (August 28 - Sept 1, 1994, San Jose Convention Center, San Jose, CA) 
            Washington, DC,  May 4-7, 1994 
   2.7  SHORT COURSE: DESIGN AND APPLICATION OF FLEXIBLE CIRCUITS
              August 24-26, 1994, Santa Clara, CA
                              and
              Sept. 26-28, 1994, Civic Center Campus, Milwaukee, WI
   2.8  INTERPACK '95:  International Intersociety Electronic Packaging Conf.
           (March 26-30, 1995; Lahaina, Hawaii)I


3: TRADE JOURNAL NEWS/ARTICLES

   3.1  NEWS: Aluminum-nitride copper bonding for MCMs (Feb 21, 1994: 
           Electronic Design magazine).
   3.2  NEWS: MCM-D Technology Fuels Notework Workstation (Feb 21, 1994:
           Electronic Design magazine).
   3.3  NEWS: Electronic Packaging Book Series (March 1994, EP&P magazine).
   3.4  NEWS:  New Substrate Material for Thermal Management (March 1994,
           EP&P magazine).
   3.5  NEWS: High Frequency Laminate for PCBs (March 1994, EP&P magazine).
   3.6  ARTICLE: Reviewing Today's Cooling Techniques (May 1994, EP&P
           Magazine).  S. Sridhar et al., CALCE Electronic Packaging
           Research Center, University of Maryland, College Park, MD.
   3.7  PICTORIAL: MCMs Ready for Market Expansion (May 1994, EP&P Magazine). 
   3.8  ARTICLE: Packaging Alternatives with 3-D Technology (May 1994, EP&P
            Magazine).  R. Crowley and E.J. Vardaman, Techsearch International
            Inc., Austin, TX.
   3.9  NEWS:  Study Points to EMI Problems in MCM Designs (May 16, 1994
            Electronic Design, pp 45-46). 
   3.10  NEWS:  Known-Good Die Barriers Continue to Crumble (June 1994,
            Computer Design, p. 24). 
            CALL FOR PAPERS:  Due Date June 20, 1994.
   3.11 ARTICLE:  "High-density interconnections with thick-film MCMs", J-P.
            Cazenave, Dassault Electronique, Saint-Cloud, France.
            (May 1994 Solid State Technology, pp. 47-51).
            CALL FOR PAPERS:  Due date June 30, 1994 
   3.12 ARTICLE: "Ultrathin Packages:  Are They Ahead of Their Time?", R. Iscoff 
           (editor):  (May 1994, Semiconductor International, pp. 48-52).
   3.13 ARTICLE: "Multichip modules march on", S. Chin (editor); (May 1994,
            Electronic Products, pp. 25-26).
   3.14 ARTICLE:  "How to Specify Multichip Modules", H. Green (MicroModule
            Systems, Inc.); (May 1994, Electronic Products, pp. 29-31).

4: BOOKS

   4.1  "Conceptual Design of Multichip Modules and Systems" by P.A.
           Sandborn and H. Moreno (MCC).  1993.  ISBN 0-7923-9395-3 (280 pp) 
   4.2  "Integrated Circuit, Hybrid, and Multichip Module Package Design
           Guidelines: A Focus on Reliability" by M.G. Pecht.
           1993.  ISBN 0-471-59446-6  (448 pp)
   4.3  "Quality Conformance and Quantification of Microelectronic
            Packages and Interconnections" by M.G. Pecht, A. Dasgupta,
            J. Evans, and J. Evans.
            1994.  ISBN 0-471-59436-9  (375pp).
   4.4  "Proc. International Conference and Exhibition: Multichip Modules,
            Apr. 13-15, 1994, Denver, Colorado"
            SPIE Vol. 2256, ISBN 0-8194-1570-7, (640 pp).
   4.5  "Proc. on Optoelectronic Interconnects II, Jan 26-27, 1994, Los
            Angeles, CA"
            SPIE Vol. 2153, ISBN 0-8194-1448-4 (376pp)

<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>
<<<<<<<<<<<>>>>>>>>>>>>>>>>>>
<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>
    
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*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 1     ********************************
*************                                                  **************
*************                  RESOURCES                       **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
    
----------------------------------------------------------------------------
*ITEM 1.1  The ARPA (ASEM) MCM Brokerage Service (Submitted by A. Rucinski)  
----------------------------------------------------------------------------

     The ARPA (ASEM) sponsored MCM brokerage service at USC/ISI interfaces
     system designers to domestic MCM foundries. The brokerage provides
     access to low cost, prototype multichip module (MCM-D and MCM-L)
     fabrication.  The brokerage service is similar to MOSIS, the
     integrated circuits prototyping service. Like MOSIS, users share the
     costs of tooling and manufacturing through the use of standard module
     sizes and packages.

     The ASEM broker's task is to be a technology enabler by supplying a
     standard interface between designers and fabricators in a way
     transparent to designers. The broker reduces costs of projects by
     sharing phototooling expenses and MCM substrate fabrication through
     multiproject runs. A suite of services covering different technologies
     are provided. These include design and test assistance and a set of
     open-tooled standard packages. In addition, the broker qualifies
     potential vendors and maintains a qualified vendor base.  In total,
     this simplifies rapid system prototyping.

     To be part of a multiproject runs, designers must comply with the
     following restrictions (1) one of a set of standard MCM substrate
     sizes (25, 37, 47, 57mm (MCM-D) must be used, (2) each size has
     standard pad locations with designated power/ground and signal pads,
     (3) these are supported by a set of standard packages and (4) use only
     two signal, one power, one ground layers. The broker will augment the
     vendor-supplied design kits with template files for these substrates
     and packages.

     Customers will provide the broker with a design database from CAD
     tools using design kits supported by the fabricator. Currently Cadence
     Allegro, Harris Finesse and Mentor Graphics MCM Station are in use.
     The broker is also working with Tanner Research to develop design
     kits. If other design tools would be useful, please send an email
     message to 'amosis@isi.edu'.

     Design kits
     		Cadence		Harris		Mentor
		
     IBM-Fishkill	available	---		available
     IBM-Endicott	4Q94 (est)	4Q94 (est)	---
     MMS		---		---		available
     Motorola	3Q94 (est)	---		3Q94 (est)
     nChip		3Q94 (est)	---		available
     TI		1Q95 (est)	available	4Q94 (est)

     The broker will place a standard comparison design on each run. This
     design will be tested alongside customer designs during the
     unpopulated substrate test. For functional test of assembled modules,
     standard load boards for the standard pin assignments will be used on
     per-pin functional test systems. Test vectors for each design will be
     screened for the target tester prior to functional testing.

     Known good die are critical to successful MCMs. The ASEM broker will
     work with ISI's ARPA sponsored 'FAST' broker to procure die through
     distributors and other third party sources and well as from die
     manufacturers. Custom die can also be tested, either in wafer form or
     through the use of temporary packages.

     For initial cost estimates, the following preliminary cost schedule
     has been prepared. These costs are based on vendor quotes and assume
     the designers meet the user requirements of fixed pad locations/pinout,
     standard layers and substrate sizes. Die costs are NOT included and
     functional test costs are additional. Users will receive five modules
     per design.

     The costs for 25mm sizes are
       - MCM substrate : $3000-$7000
       - pkg and assembly : $3000-$7500
       - total : MCM+pkg+assembly : $10000-$11000

     The costs for 47mm sizes are:
       - MCM substrate : $12000-$18000
       - pkg and assembly : $4000-$7500
       - total : MCM+pkg+assembly : $14000-$18000

     In summary, the ASEM broker qualification runs are due back starting in
     May, and a fabrication schedule to be announced in July. Regularly
     scheduled runs will start during the third quarter of this year.
     Potential customers can reach the ASEM broker by sending a email
     message to 'amosis@isi.edu'.



----------------------------------------------------------------------------
*ITEM 1.2  VIDEO TRAINING FOR PRINTED WIRING BOARD FABRICATION AND
           ASSEMBLY.  
----------------------------------------------------------------------------

     The Institute for Interconnecting and Packaging Electronic Circuits
     (IPC) offers a number of videos and color slide sets dealingi with
     various aspects of packaging.  Representative examples include
          a) "PWB Visual Acceptability"
          b) "Interlayer Handling: Parts 1,2,3,4 and 5"
          c) "Basic multilayer fabrication"        
          d) "Double Sided Board Fabrication"
          e) "Bare Board Handling"

     For information, contact 
          IPC
          7380 N. Lincoln Avenue
          Lincolnwood, IL 60646-1705
          Tel: (708)677-2850
          Fax: (708)677-9570


----------------------------------------------------------------------------
*ITEM 1.3  SIGNAL INTEGRITY MAILING LIST (Submitted by Paul Franzon).  
----------------------------------------------------------------------------

     ANNOUNCEMENT:  The Signal Integrity Mailing List has been activated.

     Purpose:  The si-list is intended to be a forum for professionals both
          in industry and academia to: discuss signal integrity matters, ask
          questions pertaining to si, make announcements related to si-related
          functions, and anything else you can think of related signal integrity.

          Modeling, simulation, measurements, software, EMC/EMI are some
          of the areas for discussion which come to mind.

          If interest warrants, I can provide ftp space on a publically
          accessible server for signal integrity related files and programs.

     HOW TO USE:

       a)  To send a message to the list of subscribers:
                    ==> email to: si-list@android.ebay.sun.com  <==

          Any message sent to this address will be broadcast to ALL
          subscribers of the list.  Remember that this list is comprised of
          members from various organizations both academic and commercial
          scattered across the continent, so be careful not to post
          proprietary information.  Please use the si-admin address described
          below for adminstrative matters.  This will help maximize the signal
          to noise ratio on the list and keep admin messages from flooding
          everyone's mailbox.

      b)  For administrative matters (subscribe, unsubscribe, change address, etc.):
                    ==> e-mail to: si-admin@android.ebay.sun.com  <==

          Any message sent to this address will NOT go to the general list, but
          will result in local action being taken to administer the list.
          Please note that at this time adminstration is being done manually
          so any admin requests will not take effect instantly but may take
          1 to 2 days in some cases.  Please list the action desired
          (subscribe, unsubscribe, change, etc.) in the subject line.  Describe
          the change in the body of the message.  Form isn't important as a human
          will be reading the message.

     FURTHER DETAILS:

          The membership of an internet mailing list is a dynamic quantity
          that will change over time.  However, to give you an idea of the
          initial membership, the following list shows those who are presently
          subscribed to the list.

          raymond.anderson@uranium.ebay.sun.com
          raymonda@crosstalk.ebay.sun.com
          weston.beal@arrakis.ebay.sun.com
          lovewell@lovewell.ebay.sun.com
          erich.selna@eng.sun.com
          eric.bagatin@eng.sun.com
          tomb@amcc.com
          pschau@amp.com
          ddelute@isi.edu
          gilg@mcc.com
          Jean-Jacques.Hajjar@analog.com
          cairo!dah@uunet.uu.net
          HWTT@asic.sc.ti.com
          signal-integrity@harris.mlb.semi.harris.com
          jjr@bnr.ca
          ldsmith@sjevm5.vnet.ibm.com
          jwang@swanson.com
          gaofent@tanner.com
          rmittra@decwa.ece.uiuc.edu
          jose@decwa.ece.uiuc.edu
          paulf@ncsu.edu
          canright@convex.com
          smehrot@eos.ncsu.edu
          mbs@eos.ncsu.edu
          slipa@eos.ncsu.edu
          jtschaff@eos.ncsu.edu
          astanas@eos.ncsu.edu
          yctekmen@eos.ncsu.edu
          charvat@eos.ncsu.edu
          clark@contec.com
          raghu@contec.com
          dileep@contec.com
          pwang@contec.com

     Thanks to all of those that expressed interest in the concept of an
     internet signal integrity mailing list.

               Raymond E. Anderson  WB6TPU
               Signal Integrity Engineer
               Sun Microsystems
               2550 Garcia Ave.  MS MIL04-16
               Mountain View, CA  94043-1100

               Tel:  (408)276-5224
               Fax:  (408)956-0492
               raymond.anderson@sun.com

     ________________________________________________________________________
     This response does not represent the official position of, or statement by,
     SUN Microsystems Inc.  The above data is provided for informational
     purposes only.  It is supplied without warranty of any kind.
     ________________________________________________________________________

----------------------------------------------------------------------------
*ITEM 1.4  FAST, CROSSTALK-DRIVEN MCM ROUTER (submitted by D. Bhatia)  
----------------------------------------------------------------------------

     A fast, crosstalk driven router for the multichip modules (MCMs) for
     improved performance has recently been designed for high density (MCM-D)
     type designs.  The router, ina ddition to minimizing the wirelength used
     for routing, aims at placing the wires that carry high frequency signals
     apart to reduce the electromagnetic interaction among the routed wires,
     thus reducing the crosstalk.  The number of routing layers used for
     routing layers used for routing is also minimized.  The router is
     capable of generating many routing solutions by varying an input
     parameter called the via control parameter.  The nubmer of vias used
     in routing can also be controlled with this parameter.  Thus, for any
     MCM substrate, the router can give multiple number of solutions with a 
     clear tradeoff between the number of vias used for routing and the
     estimated crosstalk.  Also, since the router is extremely fast, it
     gives the designer a capability to explore the many routing solutions.
     This is a desired feature that lets a designer pick best and suitable
     routed solutions.  The router has successfully routed a variety of large
     and small industrial examples.  The router produces output as a magic
     file, thus providing means for manual interaction using the magic layout
     editor.  The output can be converted to fabricatable mask data.

     For further information and availability, please contact
          Dr. Dinesh Bhatia
          Design Automation Laboratory
          ECE Dept.
          University of Cincinnati
          Cincinnati, OH 45221-0030

          Dinesh.Bhatia@uc.edu



*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 2     ********************************
*************                                                  **************
*************     SCHEDULE OF CONFERENCES/MEETINGS             **************
*************                                                  **************
*****************************************************************************
*****************************************************************************

----------------------------------------------------------------------------
*ITEM 2.1   IEEE MULTI-CHIP MODULE CONFERENCE (submitted by Bob Frye)
            (February 1 - 2, 1995, The Cocoanut Grove, Santa Cruz, CA) 
            Abstract Submission Deadline: AUGUST 12, 1994 
            FIRST CALL FOR PAPERS
----------------------------------------------------------------------------

     Tutorials:  JANUARY 31, 1995
     Conference: FEBRUARY 1 & 2, 1995
     The Cocoanut Grove, Santa Cruz, CA

     Sponsored by the IEEE Circuits and Systems Society, Computer Society,
     Components, Packaging and Manufacturing Technology Society, and
     Electron Devices Society.



        ___________________________________________________
        _                                                 _
        _              CONFERENCE HIGHLIGHTS              _
        ___________________________________________________


     TUTORIALS: in-depth presentation covering relevant MCM related topics.

     TECHNICAL SESSIONS: agenda designed to foster interaction among chip
     designers, system designers, CAD tool developers, and MCM technologists.

     INVITED TALKS: address the latest developments and future trends.

     PANEL DISCUSSIONS: interactive discussions of immediate needs, problem
     areas, concerns and innovative solutions.

     EXHIBITS: MCM foundry, known-good die technology, MCM design tools,
     simulation and layout benchmark posters.


        ___________________________________________________

       TECHNICAL PAPERS ARE SOLICITED ON, BUT NOT LIMITED TO:


     DESIGN FOR MCM: system and chip design specifically targeted for MCM
     technology -- custom I/O buffers, packaging-driven partition, design for
     test, design for manufacturability, design for cost.

     MCM TECHNOLOGY FOR LOW POWER SYSTEMS: minimum capacitance design, portable
     electronics, integral passive and active components, high-frequency and
     optical interfaces.

     ANALYSIS: modeling and simulation of electrical and thermal behavior of MCM
     structures, noise analysis, delay analysis, performance and cost driven
     design.

     APPLICATIONS: innovative uses of MCM technology, system-level optimization.

     TECHNOLOGY: novel MCM structures and fabrication methods.

     TESTING: methodology, design and technology for MCM test, known-good die,
     die- and wafer-level burn-in, boundary scan and built-in self-test for MCMs.

     INFRASTRUCTURE: standards, MCM foundry, university and small company access
     to MCM technology.

        ___________________________________________________

               SUBMISSION DEADLINE: AUGUST 12, 1994

     Authors should submit an extended abstract (not exceeding 2000 words, plus
     figures). The extended abstract should contain sufficient details to permit
     a careful review for technical excellence.  Authors should clearly state
     their contribution and point out new and significant results. Submissions
     may be made by mail, fax, or e-mail.

     All appropriate company and government clearances must be obtained prior
     to submission.

     Please send abstract and summary to:

        David B. Tuckerman
        nCHIP, Inc.
        1971 North Capitol Ave.
        San Jose, CA 95132
        Tel:  408-945-9992 ext. 237
        Fax:  408-945-0151
        davidt@nchip.com


     For tutorial suggestions and information:

        Paul Franzon
        Department of Electrical and Computer Engineering
        Box 7911
        North Carolina State University, Raleigh NC 27695-7911
        Tel:  919-515-7351
        Fax:  919-515-5523
        paulf@ncsu.edu


     For information on exhibits:

        Wayne Wei-Ming Dai
        Computer Engineering
        University of California, Santa Cruz
        Santa Cruz, CA 95064
        Tel:  408-459-4234
        Fax:  408-459-4829
        dai@ce.ucsc.edu


     For advance program and other information:

        Lisa Pascal
        Computer Engineering, University of California
        Santa Cruz, CA 95064
        Tel:  408-459-2263
        Fax:  408-459-4829
        lisa@cse.ucsc.edu


     Notice of acceptance will be mailed by September 20, 1994. Authors of accepted
     papers will be expected to provide a camera-ready manuscript of up to 6 pages
     on IEEE supplied model paper by November 15, 1994, for publication in the
     conference proceedings.

        ___________________________________________________

     STEERING COMMITTEE:

     Chair:  Robert C. Frye, AT&T Bell Laboratories
     Technical Program:  David B. Tuckerman, nCHIP, Inc.
     Finance and Local Arrangements:  Rui Wang, Cadence Design Systems
     Tutorials:  Paul Franzon, North Carolina State University
     Exhibits:  Wayne Wei-Ming Dai, University of California, Santa Cruz
     Past Chair:  David P. LaPotin, IBM T. J. Watson Research Center
     Asia Liason:  Yuji Okuto, NEC Corp.
     Europe Liason:  Bernard Coutois TIMA - CMP

     Sung Mo (Steve) Kang, University of Illinois
     James D. Murphy, Advanced Research Projects Agency
     David W. Palmer, Sandia National Laboratories
     King L. Tai, AT&T Bell Laboratories
     Jan Vardaman, Techsearch International
     Simon Wong, Stanford University


    
----------------------------------------------------------------------------
*ITEM 2.2  Optical Fiber Communication Conference - OFC '95: CALL FOR PAPERS
           (Abstract/Summary Deadline: Sept. 13, 1994)  
----------------------------------------------------------------------------

       The Optical Fiber Communication Conference (cosponsored by OSA,
       IEEE LEOS, IEEE Commun.) will be held Feb 26-Mar3, 1995 in San
       Diego, CA.  Traditionally, the OFC Conf. has sought to be a 
       source of leadership in identifying and focusing on new trends
       in the field of optical fiber communication.

       The technical program announcement lists (among the
       several topics which are sought) the following packaging 
       related topics: 
              * Optical component packaging
              * Optical interconnect technology
              * optoelectronic/electronic hybrid integration

       Original papers are solicited that have not been previously
       presented and that describe new technical contributions to
       the areas covered by the technical sessions such as the examples
       in packaging noted above.  Submission of papers requires
       a 35 word abstract, a 200-500 word summary, and submission of
       the categorization form attached to the call for papers.

       For information about the meeting, including paper submission,
       contact
              OSA Meetings and Exhibits Dept.
              Phone: (202)223-0920
              Fax:  (202)416-6100

       For information about exhibiting at OFC '95, contact the OSA
       exhibits dept. at (202) 416-1950.


----------------------------------------------------------------------------
*ITEM 2.3  3rd Topical Meeting on Electrical Performance of Electronic
           Packaging (Nov. 2-4, 1994, Monteray, CA)  
----------------------------------------------------------------------------

       Announcement/Call for Papers
       Sponsored by IEEE MTT Society and IEEE CPMT Society
 
       

     3 copies of abstract and a summary, not to exceed three pages,
     are due no later than June 20, 1994 to
              EPEP '94
              Engineering Professional Development
              University of Arizona
              Box 9 Harvill Building, Room 235
              Second and Olive Streets
              Tucson, AZ 85721
              Tel: (602)621-3054
              Fax: (602)621-1443
              e-mail: baltes@bigdog.engr.arizona.edu

       Include with submission an IEEE transfer of copyright.  Names
       and affiliations of all authors, including full mailing address,
       telephone number, and fax number (if available) must appear on
       the abstract and the first page of the summary.

       Chairpersons:  A. Cangellaris (cangellaris@ece.arizona.edu)
             and V.K. Tripathi (vkt@ece.orst.edu).

       The general subject of the meeting is the electrical design
       analysis, and characterization of electronic interconnection
       and packaging for perfromance-driven, high-speed/high complexity
       electronic systems.  A forum will be provided for the discussion
       of the following topics.

           * Package analysis, including numerical methods and
             algorithms; electro-magnetic analysis tools; advances
             in transmission line techniques.

           * New and innovative interconnect and packaging structures
             and their electrical performance.

           * RF/Microwave packaging structures and their electrical
             performance.

           * MMIC modules and high density packaging

           * Experimental characterization techniques and testing procedures

           * EMC/EMI effects; prediction and measurement of radiation
             from interconnect structures and packaged systems.

           * Electrical requirements, limits on performance

           * Novel designs, desing methods, wire placement and routing
             systems.

           * Low cost, high volume packaging

           *  Optoelectronic packaging; structure and system applications.

       This is the their meeign in this topical series.  The last meeting
       was held in Monterey, CA during Oct. 20-22, 1994.

----------------------------------------------------------------------------
*ITEM 2.4  1st INTERNATIONAL SYMPOSIUM ON MICROELECTRONIC PACKAGING AND
           PCB TECHNOLOGY (Sept. 19-23, 1994; Hosted by Tsinghua Univ.,
           Beijng, China)  Supported by IEEE CPMT  
----------------------------------------------------------------------------

     The symposium will address topics in the design, analysis, and
     assembly of microelectronic packaging, printed circuit boards,
     and subsystems.  There will be exhibits on CAD tools, advanced
     packaging products and PC boards from vendors in the USA and Japan.

     The working language will be English.  Technical areas include:
          *Electronic requirements and performance limints.
          *Design, placement, and routing methods and programs.
          *Applications of CAD tools in design and simulation.
          *Analysis of electrical, thermal, and mechanical performance.
          *Reliability concepts and analysis.
          *Experimental characterization techniques.
          *Material improvements and measurement techniques.
          *Assembly technology.

     Conference registration fee will be US $350.  There will be a complete
     social and spouse's program, including sightseeing to the Great Wall,
     Forbidden City, Summer Palace, and more.

     To receive complete conference brochure and registration form,
     please contact:
          Anyu Lee  M/S 12L 867       or    Wataru Nakayama
          Silicon Graphics, Inc.            Tokyo Institute of Technology
          2011 North Shoreline Blvd.        Meguro-ku, Tokyo 152, Japan
          Mountain View, CA 94043-1389
          Tel:  (415)390-2103               Tel: 81-3-3726-1111
          Fax:  (415)497-6283               Fax: 81-3-3729-0587 


----------------------------------------------------------------------------
*ITEM 2.5  16th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM
           (Sept. 11-14, 1994, Hyatt Regency La Jolla, San Diego, CA)
           Sponsored by IEEE CPMT and EIA  
----------------------------------------------------------------------------


     The IEMT Symposium is considered the leading international forum
     presenting the latest information on the applications of products
     and technologies for use in the manufacturing of electronic
     components, single and multichip packages, printed circuit boards,
     assemblies, and systems.

     Attendees (worldwide) at the Symposium include engineers and managers
     involved in manufacturing issues (equipment selection, installation,
     maintenance, inspection, testing methods, yield enhancement through
     process control, rework, reliability, quality control environmental
     issues, costs), manufacturing implementation (foundries, "shops",
     contract houses), integrating design and manufacturing (concurrent
     engineering, concurrent engineering CAD tools and frameworks, tools
     for improving design-to-prouct implementations, intelligent computer
     controlled systems) and improvements in manufacturingoperations.  
     Attendees are involved in "hands-on" laboratory, production, and
     manufacturing activities on a daily basis.

     For further information and participation, please contact:
          Dr. Daryl Ann Doane
          DAD Technologies, Inc.
          6438 La Jolla Scenic So.
          La Jolla, CA 92037
          Tel: (619)459-6795
          Fax: (619)459-4343
          e-mail: d.doane@ieee.org

----------------------------------------------------------------------------
*ITEM 2.6  SURFACE MOUNT INTERNATIONAL: Conference and Exposition
          (August 28 - Sept 1, 1994, San Jose Convention Center, San Jose, CA)
          Sponsored by EIA, IPC, SMTA and MF.   (submitted by EIA)  
----------------------------------------------------------------------------

     This year's conference theme, "design for excellence", will explore
     technology trends in the design and manufacturing of electronic
     products.  SMI continues to serve the market by moving into areas
     that effect your business and its growth.  Advanced assembly technology
     is one of those areas.  This year's program introduces topics such as
     ball grid array (BGA), chip-on-board (COB), and PCMCIA assemblies.  The
     general conference program offers industry experts discussing today's
     hot topics - MCM-Ls, No Clean Fluxes, Conductive Adhesives, Lead-free
     soldering technology and more.

     Tutorials and minicourses will be given on (1) practical reliability
     engineering, (2) SMT/FPT inspection, workmanship guidelines, and rework/
     repair techniqeus, (3) surface mount technologies: principles and 
     practices, (4) flexible circuitry: the synergistic electronic packaging
     technology, (5) MCM-L technology leads to chip-on-board, (6) Designing
     high speed PCB and MCM systems, (7) Benchmarking: It really works, 
     (8) Environmental stress screening for improved reliability, 
     (9) statistical process controls (SPC) strategies, (10) Low to medium
     volume surface mount assembly methods, (11) soldering defects, causes,
     and cures, (12) Printed circuit board repair: more than just swapping
     components, (13) Clean and no clean options for reliable PWA's,
     (14) Solder paste technology for ultra fine pitch and a green world,
     (15) Design and assembly of PCMCIA, (16) DFM for rigid and flex
     circuitry, (17) Advanced principles of surface mount land pattern
     design (IPC 782-A), and (18) Joint industry soldering standards.

     FOR INFORMATION:

          a)  Call (800)873-3976
                 or
          b) Write to
                Surface Mount International
                P.O. Box 803507
                Dallas, TX 75380-3507
     
     

----------------------------------------------------------------------------
*ITEM 2.7   SHORT COURSE: DESIGN AND APPLICATION OF FLEXIBLE CIRCUITS
              August 24-26, 1994, Santa Clara, CA
                              and
              Sept. 26-28, 1994, Civic Center Campus, Milwaukee, WI  
----------------------------------------------------------------------------


     'Flexible circuitry has grown rapidly during the past ten years.
     The options available for size and weight reduction, component
     mounting and decreased assembly labor make flex circuits the
     packaging technology of choice in many commercial and military
     applications.  This practically-oriented program draws on the
     instructor's experience to introduce new material, design techniques,
     and manufacturing processes.  The continuous updating of real world
     information that is presented makes this seminar a must"  (from
     course brochure)

     The seminar instructor is William Jacobi, president of Wm Jacobi
     & Associates.  Topics covered in the three day course include

     (1) What are flex circuits, (2) specific applications: why flex
     circuits were used, (3) how to apply flex, (4) focus on materials,
     (5) how flex is manufactured, (6) rigid-flex, (7) desinging for
     manufacturability, (8) HI-SPEED flex for digital applications,
     (9) how to specify flex, (10) design workshop: practical problem
     solving.


----------------------------------------------------------------------------
*ITEM 2.8  INTERPACK '95:  International Intersociety Electronic Packaging Conf.
           (March 26-30, 1995; Lahaina, Hawaii)  
           Sponsored by IEEE, IEPS, and JSME
----------------------------------------------------------------------------

     FINAL CALL FOR PAPERS

     "Interpack '95 will provide a premier international forum for the
     presentation and dissemination of knowledge in electronic packaging"
     (from final call for papers).

     Planned sessions will address:

         * Packaging applications: including workstation computers,
           automotive electronics, telecommunication equipment and
           mechatronics.

         * Packaging science: including structural analysis, thermal
           management, optoelectronics, material characterization,
           tribology, and physics-of-failure.

         * Packaging design:  including methodology, manufacture/assembly,
           computational methods and 3-D packages.

         * Packaging education:

     Technical papers addressubg these or related aspects of engineering
     science and practice in electrical and elctronic packaging are
     solicited.  Papers dealing with original research, innovative design,
     or analysis of technology trends and options are appropriate for this
     conference.

     Authors wishing to present a paepr, a panel presentation, or a tutorial
     on these or closely related topics should submit a 500 word abstract by
     mail, fax, or e-mail to

          Prof. Avram Bar-Cohen, Chairman Interpack '95
          Dept. of Mechanical Engineering
          Unviersity of Minnesota
          111 Church Street, SE
          Mineneapolis, MN 55455
          Tel: (612)626-7244    Fax: (612)624-1398  E-mail: abc@me.umn.edu

     or

          Prof. Tai Ran Hsu, Program Chairman 
          Mechanical Engineering Dept.
          San Jose State University
          One Washington Square
          San Jose, CA 95192-0087
          Tel: (408)924-3905    Fax: (408)924-3995

     IMPORTANT DATES:
          Abstract due: ...............  June 10, 1994
          Complete papers due:.........  July 30, 1994
          Revised accepted papers due:  October 15, 1994




*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 3     ********************************
*************                                                  **************
*************        TRADE JOURNAL NEWS/ARTICLES               **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
    
----------------------------------------------------------------------------
*ITEM 3.1  NEWS: Aluminum-nitride copper bonding for MCMs (Feb 21, 1994: 
           Electronic Design magazine).  
----------------------------------------------------------------------------
       News item states that IXYS Corp., Santa Clara, CA (408/982-0700)
       has developed a proprietary technology that bonds copper layers
       directly to aluminum nitride substrates for MCMs.  The direct
       copper bonded (DCB) process is a basis for power-chip-on-card
       technologies.

----------------------------------------------------------------------------
*ITEM 3.2  NEWS: MCM-D Technology Fuels Notework Workstation (Feb 21, 1994:
           Electronic Design magazine).  
----------------------------------------------------------------------------
       Ross Technology, Inc (Austin TX) in conjunction with nChip Inc.
       (San Jose, CA) has implemented an MCM realization of a RISC chip
       set, which is now in volume production in the Sparcbook 2, from
       Tadpole Technologies.  For information, contact Steve Goldstein,
       Ross Technology, (512)892-7802, ext 519.

----------------------------------------------------------------------------
*ITEM 3.3  NEWS: Electronic Packaging Book Series (March 1994, EP&P magazine).  
----------------------------------------------------------------------------
       McGraw-Hill publishers has announced a series of books, to
       consist of 31 titles.  The first five titles will cover
       covering basic interconnection technologies,
       microelectronics, surface mount technology, materials,
       and multichip modules (MCMs).  For additional information,
       contact the series editor, Charles Harper, at 410/252-3425.

----------------------------------------------------------------------------
*ITEM 3.4  NEWS:  New Substrate Material for Thermal Management (March 1994,
           EP&P magazine).  
----------------------------------------------------------------------------
       Texas Instruments has developed a new substrate material
       (a silver-nickel-iron combination) for power hybrids and
       MCMs.  The new material is called "Silvar" and can be formed
       by rolling, stamping, coining, forging, and drawing.  The
       thermal conductivity is only slightly lower than copper-
       tungsten.

----------------------------------------------------------------------------
*ITEM 3.5 NEWS: High Frequency Laminate for PCBs (March 1994, EP&P magazine).  
----------------------------------------------------------------------------
       Rogers Corp. has introduced a high frequency circuit material
       (RO3003) for microwave circuit boards (applications including
       cellular base station power amplifiers, RF identification
       systems, personal communications systems).  Dielectric
       constant is 3.0.  X and Y TCE (matched to copper) is 17ppm/degree C.
       Vertical TCE is 24 ppm/degree C.  Initial products are
       standard panel size (18 by 24 inches) in thicknesses of
       10 mil, 20 mil, and 30 mil, and with 1/2 oz or 1  oz electro-
       deposited copper. 

----------------------------------------------------------------------------
*ITEM 3.6  ARTICLE: Reviewing Today's Cooling Techniques (May 1994, EP&P
     Magazine).  S. Sridhar et al., CALCE Electronic Packaging
     Research Center, University of Maryland, College Park, MD.  
----------------------------------------------------------------------------
       The authors provide a very readable and informative review
       of cooling approaches, ranging from finned heat sinks to
       immersion cooling, along with comments on CAD analysis tools.
       A good set of references is also provided.

----------------------------------------------------------------------------
*ITEM 3.7  PICTORIAL: MCMs Ready for Market Expansion (May 1994, EP&P Magazine).  
----------------------------------------------------------------------------
       A three page spread with nice illustrations of representative
       MCM modules from Interconnex, AT&T, Aeroflex, ERIM, MCC, CTS,
       nChip, IBM, MicroModule Systems, CTM Electronics, S-MOS Systems,
       TI, Hughes Microelectronics, and Amkor.  Each illustrated MCM
       color illustration is accompanied by a brief summary of the
       technology used.  MCM-L, MCM-C, and MCM-D examples are included.

----------------------------------------------------------------------------
*ITEM 3.8   ARTICLE: Packaging Alternatives with 3-D Technology (May 1994, EP&P
            Magazine).  R. Crowley and E.J. Vardaman, Techsearch International
            Inc., Austin, TX.  
----------------------------------------------------------------------------
       The article reviews 3-D packaging, including TI and irvine Sensors 
       stacks but also mentioning the GE 3-D MCMs, stacked packaged die
       from Harris Corp., stacked memory from Matra Marconi Space France,
       stacked MCMs from Grumman Aerospace, AT&T's cube of processors using
       four MCMs, a Server from Sun Microsystems using stacked SRAMs,
       stacked TAB technology from Matsushita, etc.  The references are
       very brief but the range of examples is broad.

----------------------------------------------------------------------------
*ITEM 3.9   NEWS:  Study Points to EMI Problems in MCM Designs (May 16, 1994
            Electronic Design, pp 45-46).  
----------------------------------------------------------------------------
       News item regarding work at the Georgia Tech Research Institute
       (GTRI) regarding the effect of EMI on MCM designs.  GTRI's research
       identified numerous problems, all avoidable if sound EMI design
       guidelines are followed.  For information, contact John
       Rohrbaugh, GTRI, (404)894-8235, john.rohrbaugh@gtri.gatech.edu.

----------------------------------------------------------------------------
*ITEM 3.10  NEWS:  Known-Good Die Barriers Continue to Crumble (June 1994,
            Computer Design, p. 24).  
----------------------------------------------------------------------------
       "Intel (Chandler, AZ) has announced a known good die program dubbed
       SmartDie that will provide unpackaged silicon with the same
       availability, reliability, and prices as Intel's packaged components.
       SmartDie is part of Intel's Technical Alliance Program (TAP) that
       links its customers to manufacturers with expertise in mounting
       silicon directly on a substrate."

       "The SmartDie products undergo the same processes as their packaged
       products.  These include full-speed testing, screening for temperature
       over a 0 C to 80 C temperature range, die-level burn-in, and 100 %
       visual inspections during processing and packaging.

       "The SmartDie announcement comes on the heels of another development
       on the known good die front that took place at the recent Int'l
       Conf. on MCMs in Denver.  A new Die Information Exchange (DIE) 
       specification was unveiled at the conference that will play a major
       role in supporting a known-good die infrastructure.  That specification,
       created by a team of chip, MCM, and EDA vendors, outlines the physical
       data that's necessary to describe die, such as bond pad information,
       power levels, die thickness and junction temperatures."  (Mike Donlin,
       Computer Design Magazine)

----------------------------------------------------------------------------
*ITEM 3.11  ARTICLE:  "High-density interconnections with thick-film MCMs", J-P.
       Cazenave, Dassault Electronique, Saint-Cloud, France.
       (May 1994 Solid State Technology, pp. 47-51).  
----------------------------------------------------------------------------
       "High-density, thick film, multilayer technology -- developed
       by Dassault and based on the use of photoactive paste material --
       provides a cost-effective and high-performance solution to
       interconect problems for MCMs.  The technology allos high clock
       rates (up to 600 MHz), low pitch interconnects (down to 100 microns),
       and high power dissipation from the chips."  (from `Conclusions'
       of article).

----------------------------------------------------------------------------
*ITEM 3.12  ARTICLE: "Ultrathin Packages:  Are They Ahead of Their Time?", R. Iscoff 
           (editor):  (May 1994, Semiconductor International, pp. 48-52).  
----------------------------------------------------------------------------
       "Sparked by a profusion of portable consumer products, such as cellular
       phones, pagers, and notebook computers, packages thinner than 1 mm
       are making strong inroads in Japan.  The story is different here,
       however.  In the United States, most device makers find little demand
       for packages less than 1mm thick.  Like shrinking chip dimensions,
       shrinking package dimensions have a prince.  Not only that, UTPs will
       push traditional wire bonding to its limits.  As package thicknesses
       moves into the sub-mm regime, most experts view TAB, flip-chip, or
       chip-on-board technology taking over."  (From introduction to
       article).

----------------------------------------------------------------------------
*ITEM 3.13  ARTICLE: "Multichip modules march on", S. Chin (editor); (May 1994,
            Electronic Products, pp. 25-26).  
----------------------------------------------------------------------------
       This is a general summary of various companies providing
       commercial products using MCMs (includes NEC Corp, Kelly
       Microsystems, MicroModule Systems), availability of known good
       die (includes support by National Semiconductor, Motorola),
       and some emerging technologies (diamond films, 3-D stacks,).

----------------------------------------------------------------------------
*ITEM 3.14  ARTICLE:  "How to Specify Multichip Modules", H. Green (MicroModule
            Systems, Inc.); (May 1994, Electronic Products, pp. 29-31).  
----------------------------------------------------------------------------
       Article provides some general advice.  Subsection titles are
       (1) choose a partner, (2) set product cost goals, (3) reduce
       the number of ICs and passibe components in the MCM, (4) find
       a reliable source of die, (5) match the package type required
       to the application, (6) determine thermal goals, (7) select a
       substrate technology, (8) build a prototype, (9) select an
       MCM foundary, (10) develop a design strategy.





*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 4     ********************************
*************                                                  **************
*************                    BOOKS                         **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
    
----------------------------------------------------------------------------
*ITEM 4.1  "Conceptual Design of Multichip Modules and Systems" by P.A.
           Sandborn and H. Moreno (MCC).  1993.  ISBN 0-7923-9395-3 (280 pp)  
----------------------------------------------------------------------------
     `Conceptual Design of Multichip Modules and Systems treats activities
     which take place at the conceptual and specification level of the
     design of complex multichip systems.  These activities include the
     formalization of design knowledge (information modeling), tradeoffs
     analysis, partitioning, and decision process capture.  All of these
     functions occur prior to the traditional CAD activities of synthesis
     and physical design.' (From Advertisement)

          Kluwer Academic Publishers
          P.O. Box 358
          Accord Station
          Hingham, MA 02018-0358
          Tel: (617)871-6600
          Fax: (617)871-6528
          email: kluwer@world.std.com

----------------------------------------------------------------------------
*ITEM 4.2  "Integrated Circuit, Hybrid, and Multichip Module Package Design
           Guidelines: A Focus on Reliability" by M.G. Pecht.
           1993.  ISBN 0-471-59446-6  (448 pp)  
----------------------------------------------------------------------------
     `Circuit designers, packaging engineers, printed circuit board
     fabricators, and procurement personnel will find this book's 
     reliable microelectronic package design guidelines and approaches
     essential for achieving all their life cost, cost-effectiveness, and
     on-time delivery goals.' (From Advertisement)

          John Wiley & Sons, Inc.
          605 Third Ave.
          New York, NY 10158-0012

----------------------------------------------------------------------------
*ITEM 4.3  "Quality Conformance and Quantification of Microelectronic
            Packages and Interconnections" by M.G. Pecht, A. Dasgupta,
            J. Evans, and J. Evans.
            1994.  ISBN 0-471-59436-9  (375pp).  
----------------------------------------------------------------------------
     `Deals with failure mechanisms that can occur in the
     manufacture and use of integrated circuit devices arising from
     improper choice of materials, overisghts in engineering design,
     manufacturing or operating induces stresses.

          John Wiley & Sons, Inc.
          605 Third Ave.
          New York, NY 10158-0012

----------------------------------------------------------------------------
*ITEM 4.4  "Proc. International Conference and Exhibition: Multichip Modules,
            Apr. 13-15, 1994, Denver, Colorado"
            SPIE Vol. 2256, ISBN 0-8194-1570-7, (640 pp).  
----------------------------------------------------------------------------
     Sessions/Topics include (1) Die-level and wafer-level burn-in for
     known-good die, (2) Assembly and interconnections, (3) Large-format MCM
     manufacturing, (4) MCM technology in Japan, (5) MCM-L, (6) MCM
     testing, (7) Known good die and test strategies, (8) MCM-D, 
     (9) Volume applicationa, (10) Materials and processes, (11) MCM
     technology in Europe, (12) New applications, (13) Module to next
     level, (14) MCM design, and (15) Military and space.

          SPIE
          PO Box 10
          Bellingham, WA 98227-0010
          Tel: (206)676-3290
          Fax: (206)647-1445
          e-mail: bookorders@mom.spie.org

----------------------------------------------------------------------------
*ITEM 4.5  "Proc. on Optoelectronic Interconnects II, Jan 26-27, 1994, Los
           Angeles, CA"
           SPIE Vol. 2153, ISBN 0-8194-1448-4 (376pp)  
----------------------------------------------------------------------------
     Sessions/topics include (1) system-level integration, (2) free-space
     optical interconnects, (3) system evaluation demonstration, (4) Opto-
     electronic packaging, (5) guided wave optical interconnects, 
     (6) system architecture, and (7) Device demonstrations.


          SPIE
          PO Box 10
          Bellingham, WA 98227-0010
          Tel: (206)676-3290
          Fax: (206)647-1445
          e-mail: bookorders@mom.spie.org


*****************************************************************************
*                            END OF NEWSLETTER                              *
*                                                                           *
*         PACKAGING AND INTERCONNECTION ELECTRONIC NEWSLETTER               *
*                                                                           *
*                          Volume 1, Number 2                               *
*                             June 24, 1994                                 *
*****************************************************************************