*****************************************************************************
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**                                                                         **
********** IEEE Components, Packaging, and Manufacturing Technology *********
**                                                                         **
*****************************************************************************
**        PACKAGING AND INTERCONNECTION ELECTRONIC NEWSLETTER              **
**                              (FULL)                                     **
**                         Volume 1, Number 3                              **
**                          August 24, 1994                                **
**                                                                         **
*****************************************************************************
*****************************************************************************


The Packaging and Interconnections Electronic Newsletter has
been established as a vehicle for rapid and broad dissemination
of information in the general area of interconnections and 
packaging (both electrical and optical) for both electronic
and optical systems.  The newsletter is sponsored by the IEEE
Components, Packaging, and Manufacturing Technology Society
(IEEE CPMT).  The University Relations Committee of the MCM Division
of the Electronic Industries Assoication (EIA) is an affiliate of the
newsletter.

The editor of this newsletter is
        Stuart K. Tewksbury
        Microelectronic Systems Research Center
        Dept. Electrical and Computer Engineering
        Eng. Science Bldg. 827
        West Virginia University
        Morgantown, WV 26506
        Tel: (304)293-6371  ext 512
        Fax: (304)293-7486
        Email: s.tewksbury@ieee.org

Full copies as well as summaries and tables of contents of this and earlier
newsletters are available by ftp or gopher to msrc.wvu.edu (157.182.197.50).


        
<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>
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<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>
    
To subscribe to the PKG_NEWS, send an e-mail
message to "pkg_news@msrc.wvu.edu".  The body of the message should
include the following:
    i)  Full name
   ii)  Full mailing address
  iii)  Telephone number
   iv)  Fax number
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*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
*******************        Table of Contents        *************************
*****************************************************************************
*****************************************************************************
 
1: RESOURCES:  None this issue


2: CALENDAR OF CONFERENCES/MEETINGS

   2.1  1995 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM: CALL FOR PAPERS
           (April 3-6, 1995, Las Vegas, Nevada)
           (Submission Deadline: Sept. 23, 1994 
   2.2  45th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE-1995 CALL 
           FOR PAPERS.  May 21-24, 1995, Las Vegas, Nevada. 
           (Submission Deadline: Oct. 31, 1994)  Sponsered by IEEE & EIA.         
   2.3  1995 IEEE-MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM--CALL 
           FOR PAPERS.  (May 15-19, 1995, Orlando, FL. 
           (Submission Deadline: Nov 1, 1994)   
   2.4  1995 INTERNATION INTERSOCIETY ELECTRONIC PACKAGING CONFERENCE.  
           CALL FOR PARTICIPATION.  (March 26-30, 1995, Westin Maui, 
           Kaanapali Beach, Hawaii)   
   2.5  INTERNATIONAL CONFERENCE ON ELECTRONIC COMPONENTS AND MATERIALS
           AND INTERNATIONAL CONVERENCE ON SENSORS AND ACTUATORS.    
           CALL FOR PAPERS.  (Oct. 5-8, 1995, Xi'an China) 
           Abstract due Jan 31, 1995.
   2.6  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING
           TECHNOLOGY.  CALL FOR PAPERS.  (Abstracts due by Dec. 1, 1994).      
   2.7  11th IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT
           symposium.  (Feb. 7-9, 1995, San Jose, CA  USA)        
   2.8  INTERpack '95. (March 26-30, 1995, Lahaina, Hawaii) 
   2.9  GOVERNMENT MICROCIRCUIT APPLICATIONS CONFERENCE
           (November 7-10, 1994, Town and Country Hotel, Santa Diego, CA).       
   2.10  16th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM.  
           (SEPT 11-14, 1994, La Jolla, California.)     
   2.11  MICROELECTRONIC MANUFACTURING '94.  (Oct 18-22, 1994, 
		   Austin, TX, USA)  Sponsered by SPIE.	   
   2.12  THE 27th INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS.  
           (NOV 15-17, 1994, Boston, MA)  Sponsored by ISHM.     
   2.13  11th IEEE MULTI-CHIP MODULE CONFERENCE  MCMC-95.  
           (Feb. 1-2, 1995, Santa Cruz, Ca  USA).      
   2.14  40th HOLM CONFERENCE ON ELECTRICAL CONTACTS.  (Oct. 17-19, 1994, 
           Chicago, Illinois  USA)         
   2.15  3rd TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC 
           PACKAGING.  (Nov. 2-4, 1994, Monterey Plaza Hotel, CA  USA).        
   2.16  1st INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS PACKAGING
           AND PCB TECHNOLOGY. (Sept 19-23, 1994, Tsinghau University, 
           Beijing, China).          
   2.17  BALL GRID ARRAY/FLIP CHIP WORKSHOP.  (Oct. 19-21, 1994, 
           Binghamton, NY)  Sponsored by IEEE CPMT and Binghamton CPMT.
           
3  TC-6 NEWS (IEEE CPMT: June 2, 1994: CPMT Newsletter).

   3.1  Automotive Electronic Packaging:  
   3.2  Wireless Electronic Packaging:
           
4: TRADE JOURNAL NEWS/ARTICLES

   4.1  NEWS: "Diamond-copper-silver alloy developed for MCM substrates"  
           (July, 1994, Solid State Technology, p 36).         
   4.2  NEWS: "Sensors Used for Flaw Detection"  (June 13, 1994, 
           Electronic Design, p 27).         
   4.3  NEWS: hyperSPARC Processor (July, 1994, Semiconductor 
           International, p. 56)  Ron Iscoff.          
   4.4  NEWS: SPARC Multichip Module Prototype  (July, 1994, Semiconductor 
           International, p. 56)  Ron Iscoff.          
   4.5  NEWS: "3-D Multichip Module to be Demonstrated"  April 4, 1994, 
           Electronic Design, p 27).          
   4.6 NEWS: Bare Die Pentium Ships for MCM Designs (March, 1994, 
           Computer Design, p. 26).  Mike Donlin.           
   4.7 ARTICLE: "Pick the Right Package for Your Next ASIC Design"  
           (Feb. 3, 1994, EDN, p. 91-108).  David P. Pivin, ASIC Division, 
           Motorola Semiconductor Products Sector.           
   4.8 ARTICLE: CPLD Module (Cover) (April, 1994, EP&P, p. 76-78)
           Dave Bursky.
   4.9 ARTICLE: "Circuit Material for Commerical High Frequency 
           Applications" (March, 1994, Micrwave Journal, p. 116).  Rogers Corp.
           Microwave & Circuit Materials Division, Chandler, AZ (602) 961-1382.
   4.10 ARTICLE: Slow Acceptance of MCMs (March, 1994, Computer Design, 
           p. 73-76, 88-90).  Mike Donlin, Senior Editor.
   4.11 ARTICLE: Designing a four-processor SDP MCM with 3-D memory  
           (March, 1994, Computer Design, p. 77-80).  Stan Drobac, vice 
           president of products and services, nCHIP and Mike Brock, program 
           manager for MCM design at Texas Instruments.
   4.12 ARTICLE: A Case Study of MCMs:  Three Successful Designs  
           (March, 1994, Computer Design, p. 81-84).  Tony Mazzullo, vice
           president of business development, Harris EDA.
   4.13 ARTICLE: Glass-On-Silicon Substrate to Carry Microwave ICs  
           (June 13, 1994, Electronic Design, p 56)  David Maliniak.
   4.14 ARTICLE: PCMCIA: (April, 1994, Printed Circuit Fabrication, p 16-18). 
           Jerry Murray, West Coast Editor.
   4.15 ARTICLE: Designing a four-processor SDP MCM with 3-D memory:  
           (March, 1994, Computer Design, p. 77-80).  Stan Drobac, vice 
           president of products and services, nCHIP and Mike Brock, program 
           manager for MCM design at Texas Instruments.

5: BOOKS

   5.1  "Handbook of Electronics Packaging Design and Engineering," 
           second edition by Bernard S. Matisoff. 1990. Van Nostrand Reinhold
           (656 pages).
   5.2  "Electronic Equipment Packaging Technology" by G. L. Ginsberg.
           1993. Van Nostrand Reinhold (279 pp).
   5.3  "Hybrid/MCM Technology" ed. T. L. Hodson. Cahners Publishing Co.
   5.4  "Surface Mount Technology for Concurrent Engineering
           and Manufacturing" by F. Classon. 1993. McGraw Hill (283 pp).
   5.5  "Compendium on Electronic Packaging" ed. D. E. Swanson. 1993. 
           Cahners Publishing Co. 
   5.6  "Multichip Module Technologies and Alternatives: The Basics" 
           ed. D. A. Doane and P. D. Franzon. 1993.  Van Nostrand Reinhold 
           (875 pp).
           
           
           
*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 2     ********************************
*************                                                  **************
*************     SCHEDULE OF CONFERENCES/MEETINGS             **************
*************                                                  **************
*****************************************************************************
*****************************************************************************

----------------------------------------------------------------------------
*ITEM 2.1  1995 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM: CALL FOR PAPERS
           (April 3-6, 1995, Las Vegas, Nevada)
           (Submission Deadline: Sept. 23, 1994)  
----------------------------------------------------------------------------
       'The 1995 Symposium will continue emphasizing building-in reliability
       for VLSI devices and hybrid components during their design, 
       manufacture and test.  Papers are solicited that illustrate the 
       incorporation of reliability physics, reliability engineering, 
       out-of-spec design tolerance, fabrication, assembly, and manufacturing
       process control to improve system reliability.'  
                                                  -from CALL FOR PAPERS
                                                  
       Papers are solicited on:
            * Building-in Reliability
            * Testing Methodologies for Reliability
            * Analyzing for Reliability
       
       20 copies of abstract (50 words) and a 2-page summary (figs included)
       that states the specific results, importance, and relation 
       to prior work of the previously unpublished work 
       are due no later than Sept 23, 1994 to
              Ajit K. Goel, Technical Program Chairman, 1995 IRPS
              Oneida Research Services, Inc. 
              540 Weddell Drive, Suite 7
              Sunnyvale, CA 94089 USA
              Phone:  (408) 734-2987
              FAX:  (408) 734-2984
              e-mail:  AjitG@AOL.com

       Specify in the cover letter the submission category:
       1. BIR, 2. Packaging, 3. Dielectrics, 4. Failure analysis/ESD/Latch-up,
       5. Hot Carriers, 6. Devices and Processes, 7. Compound Semiconductor
       and Photonics, 8. Metallization, 9. Other.
       
       The 20 copies muct include the title of the paper, and the name, 
       affiliation, complete return address, telephone and telefax numbers
       and e-mail addresses, if available for each author.  Submissions 
       should be by post or express mail.  All submissions will be 
       acknowledged.  
       
       Late Papers:  A limited number of late papers reflecting important
       last-minute developments will be considered on a space available basis.  
       Abstract and summary must be received by December 1, 1994.
  
       For general conference information,  contact
              
       USA:                                  Asia:
       Joe McPherson                         Dr. Eiji Takeda
       General Chairman, 1995 IRPS           IRPS Publicity Committee
       Texas Instruments, Inc.               Hitachi Ltd.
       P.O. Box 655012 M/S 385               P.O. Box 2
       13353 Floyd Road                      Kokubunji, Tokyo 185  
       Dallas TX 75243 USA                   Japan
       Phone: (214) 995-2183                 Phone:  (81) 423-23-1111 x3300
       FAX:  (214) 995-2932                  FAX:  (81) 423-27-7699
       e-mail:JOMC%mimi@magic.itg.ti.com     e-mail: ETakeda@CRL.Hitachi.Co.Jp
              
                                  Europe:
       Mauro Ciappa                            Dr. Wolfgang Gerling
       IRPS Publicity Committee                IRPS Publicity Committee
       Swiss Federal Institute of Technology   Siemens AG
       Reliability Laboratory                  P.O. Box 801709
       ETH-Zentrum                             D-81617 Munich
       CH-8092 Zurich, Switzerland             Germany
       Phone:  (41) 1-256-2536                 Phone:  (49) 89 4144-2825
       FAX:  (41) 1-251-2172                   FAX:  (49) 89 4144-3828
       e-mail:  Ciappa@Nimbus.ethz.ch       
                         
          
----------------------------------------------------------------------------
*ITEM 2.2  45th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE-1995 CALL 
           FOR PAPERS.  May 21-24, 1995, Las Vegas, Nevada. 
           (Submission Deadline: Oct. 31, 1994)  Sponsered by IEEE & EIA.
----------------------------------------------------------------------------
    
        'The aim of the conference is to continue to offer quality coverage
        of technological innovations in the areas of design, materials, 
        processes, quality, and manufacturing for devices, components and 
        systems.  This year [they] are particularly interested in the 
        emerging areas of portable electronics, flat panel displays, and
        wireless technologies."  (from brochure)
    
        10 copies of a 500-word abstract describing the scope, content and 
		key points of proposed paper to
		
		John M. Segelken
		AT&T Bell Laboratories 3F-310
		67 Whippany Road
		Whippany, NJ 17981-0903
		Tel:  (201) 386-4703
		FAX:  (201) 386-2942
		e-mail:  jms@whamt.att.com
		
		The abstracts must be received by October 31, 1994.  Include mailing
		address, e-mail address, business phone, and fax.  (Foreign authors
		should also include a telex number.)
		
		Choose no more than two of the following subcommittees that should 
		consider your paper:
		    * Components                    * Modeling and Simulation
		    * Connectors                    * Multichip Packaging
		    * Interconnections              * Opto-Electronics
			* Manufacturing Technology      * Poster 
			* Materials and Processing      * Quality and Reliability
			               * Single Chip Packaging
		
		IMPORTANT DATES:
			* Abstracts due October 31, 1994
			* Acceptance Notification December 16, 1994
			* Final Form Manuscripts due February 1, 1995
			
----------------------------------------------------------------------------
*ITEM 2.3  1995 IEEE-MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM--CALL 
           FOR PAPERS.  (May 15-19, 1995, Orlando, FL. 
           (Submission Deadline: Nov 1, 1994)
----------------------------------------------------------------------------
    
        Paper submission requirements are as follows:
        1.  10 copies of a 30-50 word abstract.  (include title and author)
        2.  15 copies of 500-1000 word summar with supporting illustrations
             (including title and author)
        3.  A separate sheet with mailing addres and fax of author, statement
              indicating preference for full length (20 min) short (10 min) 
              or interactiveforum presentation, and a priortized list of up 
              to three areas from the following list, appropriate 
              for your paper's review.
          
        * Biological Effects & Medical  * Manufacturing, Production & 
          Applications                    Packaging
        * Passive Components            * Microwave Integrated Circuits
        * Acoustic & Surface Wave       * Millimeter & Submillimeter
          Components                      Wave Technology
        * Guided Waves & Propagation    * EM Analytical & Numerical Techniques
          Characteristics               * Field Theory
        * Filters and Multiplexers      * Monolithic Circuits & Modules
        * Ferrite Components            * CAD Procedures, Techniques & Modeling
        * Non-Linear Modeling &         * Mocrowave & Communication Systems
          Analysis                      * Active & Quasi-Optic Arrays
        * Transistor Power              * Lightwave Technology & Techniques
          Amplification                 * Superconductivity Technology
        * Sources and Control           * Digital Signal Processing
          Components                    * Vehicular Technology
        * Measurement Theory &          * Wireless Technology
          Techniques                    * Phased Arrays
        * High Power Sources &          * Low Noise Receivers & Detectors
          Control                            
        
        
        ALL PAPER SUBMISSIONS MUST BE IN ENGLISH & RECEIVED BY NOV 1, 1994
        Mail to
            MTT-S SYMPOSIUM 1995
            c/o LRW Associates
            1218 Balfour Drive
            Arnold, MD 21012, USA
 
----------------------------------------------------------------------------
*ITEM 2.4  1995 INTERNATION INTERSOCIETY ELECTRONIC PACKAGING CONFERENCE.  
           CALL FOR PARTICIPATION.  (March 26-30, 1995, Westin Maui, 
           Kaanapali Beach, Hawaii)  
----------------------------------------------------------------------------  
       'Exhibits of electronic packaging hardware are sought.  This includes
        multichip modules, surface mount technology, optical interconnects, 
        disk drives, memory cards, connectors, card cages, heat sinks and 
        any other form of packaging and/or interconnect hardware.  In addition
        to commerical products, experimental apparatus from academia and 
        industry is welcome, as is hardware for therman management.'  
                                                          (from advertisement)
                                                          
        To participate, send brief description of hardware to exhibit to:
            David Copeland
            Department of Mechanical and Intelligent Systems Engineering
            Tokyo Institute of Technology
            2-12-1 Oh-okayama, Mequro-ku
            Tokyo 152 Japan
            Phone:  3-5734-3239
            FAX:  3-3729-0587
            e-mail:  david@mep.titech.ac.jp
            

----------------------------------------------------------------------------
*ITEM 2.5  INTERNATIONAL CONFERENCE ON ELECTRONIC COMPONENTS AND MATERIALS
           AND INTERNATIONAL CONVERENCE ON SENSORS AND ACTUATORS.    
           CALL FOR PAPERS.  (Oct. 5-8, 1995, Xi'an China) 
           Abstract due Jan 31, 1995.
----------------------------------------------------------------------------
           
        Submit a 1 page abstract by Jan 1, 1995 to:
                   
            Prof. Yuan Jijun    
            ICECM
            Secretart
            North China Research Institute of Optoelectronics
            P.O. Box 8511
            Beijing, 100015, China

----------------------------------------------------------------------------
*ITEM 2.6  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING
           TECHNOLOGY.  CALL FOR PAPERS.  (Abstracts due by Dec. 1, 1994)
----------------------------------------------------------------------------
        
        The Second Special Section on the Applications of Intelligent 
        Manufacturing Technologies in Semiconductor and Electronics 
        Manufacturing
        
        This section is to survey state-of-the-art research and development
        work in intelligent manufacturing, neural networks, fuzzy logic, 
        and other emerging technologies and their applications to 
        semiconductors and electronics manufacturing.
        
        Topics of interest include:
        1. THEORY
            * Basic theory 
            * Design guidelines and procedures
            * Issues of flexible computer integrated manufacturing
            * Robustnbess and handling of nonlinear systems and chaotic behavior
        2. HARDWARE
            * Specialized systems, hardward and VLSI implementation 
              for intelligent manufacturing
            * Hardware accelerators
            * System integration issues
        3. APPLICATIONS
            * Intelligent manufacturing, process control and optimization
            * Product quality access
            * Automated inspection
            * Recovery from disruption
            * Decision making and process recipe selections
            * Comparative evaluations and other uses
        
        Abstracts should be submitted to one of the guest editors 
        before Dec 1, 1994
        	Dr. Hua Li                           Dr. Kam Yeung
        	Texas Tech University                AT&T
        	Computer Science Dept.               Two Oak Way
        	College of Engineering               Rm 3ND09
        	Lubbock, TX 79409                    Berkeley Heights, NJ 17922
        	Phone:  (806) 742-3513               Phone:  (908) 771-2771
        	FAX:  (806) 742-3519                 FAX:  (908) 771-4503
        	e-mail:  xdhua@ttacs.ttu.edu

----------------------------------------------------------------------------
*ITEM 2.7  11th IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT
           symposium.  (Feb. 7-9, 1995, San Jose, CA  USA)  
---------------------------------------------------------------------------- 
        'Semi-Therm is an international forum dedicated to new developments 
        in the thermal characterization of electronic components and systems.
        The symposium is designed to foster the exchange of information 
        from both the academic and industrial communities on advances 
        in the thermal management of electronic systems.  Semi_Therm is
        well-known for its workshop atmosphere with single-session programs 
        couples with technical workshops, tutorials, vendor exhibits, and 
        optional short courses.'  (From advertisement)
        
        Topical Coverage: 
        	* Thermal Characterization
        	* Analytical and Computational Thermal Modeling
        	* Measurement Techniques Including Temperature, Fluid Flow
        	  and Thermal Mechanical Properties
        	* Thermal Reliability Screening and Testing
        	
        For more information, contact
            Program Chair
            Prof. Vincent P. Manno
            Tufts University
            Mechanical Engineering
            Medford, MA 02155 USA
            Phone:  (617) 628-5000, x2548
            FAX:  (617) 627-3819
            e-mail:  vmanno@pearl.tufts.edu
            
----------------------------------------------------------------------------
*ITEM 2.8 INTERpack '95. (March 26-30, 1995, Lahaina, Hawaii) 
----------------------------------------------------------------------------   
           
        'A premier international forum for the presentation and 
        dissemination of knowledge in electronic packaging.'
                    (from advertisement)
                    
        Planned Sessions:
            * Packaging Applications
            * Packaging Science
            * Packaging Design
            * Packaging Education
                
        Call Brian Bigalke at (212) 705-7057 for information
----------------------------------------------------------------------------
*ITEM 2.9  GOVERNMENT MICROCIRCUIT APPLICATIONS CONFERENCE
           (November 7-10, 1994, Town and Country Hotel, Santa Diego, CA) 
----------------------------------------------------------------------------

       'GOMAC is a Government-sponsored conference established primarily 
       to review developments in microelectronics applications for 
       government systems.'  'The GOMAC '94 Conference theme will focus 
       on the experiences that both government and industry have had
       in either adapting technology developed for military markets
       in civilian applications or utilizing technology developed 
       in the civilian economu for millitary applications.' (from brochure)  

      
       For further information,  contact
          Harry Weaver                      Sven A. Roosild
          General Conference Chair          Technical Program Chair
          Sandia National Laboratories      ARPA
          Division 1321                     3701 N. Fairfax Dr.
          Albuquerque, NM 87185             Arlington, VA 22203-1714
          Phone: (505) 844-8145             Phone:  (703) 696-2235
          Fax:  (301) 688-0715              FAX:  (703) 696-2201
          									e-mail:  srossild@arpa.mil            
----------------------------------------------------------------------------
*ITEM 2.10 16th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM.  
           (SEPT 11-14, 1994, La Jolla, California.) 
----------------------------------------------------------------------------
            
         This year's symposium theme is "Low-Cost Manufacturing Technologies
         for Tomorrow's Global Economy."  Sessions include 
         
         * Conductive Adhesives, Lead-Free Interconnects & No-Clean Slodering
         * Inspection & Testing
         * Surface Mount Technology
         * Manufacturing Management
         * Flip Chip Technology
         * Modeling & Statistical Methods
         * Intelligent Systems
         * Fifth Pitch Connections & Multichip Packages
         * Manufacturing Information & Control Systems
         * Manufacturing Issues for Ball Grid Array Packages
         * Manufacturing Process Improvement
         
         The '94 conference will hold a day-long Product and Exhibit 
         Demonstration Session Sept 13, 1994.
         
         For more information, contact
             Dr. Daryl Ann Doane
             DAD Technologies, Inc.
             P.O. Box 2915
             La Jolla, CA 92038
             Phone:  (619) 459-6795
             FAX:  (619) 459-4343
             e-mail:  d.doane@ieee.org
             
----------------------------------------------------------------------------
*ITEM 2.11 MICROELECTRONIC MANUFACTURING '94.  (Oct 18-22, 1994, 
		   Austin, TX, USA)  Sponsered by SPIE. 
----------------------------------------------------------------------------      
        Technical Conferences:
            2334:  Microelectronics Manufacturability, Yield and Reliability
            2335:  Mieroelectronic Technology and Process Integration
            2336:  Manufacturing Process Control for Microelectronic 
                   Devices and Circuits
            2337:  Optical Characterization Techniques for High-Performance
                   Microelectronic Device Manufacturing
                   
        NAPEM Courses:
            * Lithography for Manufacturing
            * Survey of Optoelectronic Devices
            * Optoelectronic Interconnects and Packaging
            * Optical Methods for Passive Monitoring of Bulk and Surface
              Properties in Semiconductor Manufacturing
            * Optical Diagnostic Techniques for Plasma Processing
            * Semiconductor Material and Device Characterization
            * Process Integration Issues in Microelectronic Manufacturing
            * Silicon Defect Engineering Science and Technology
            * Advances Silicon Wafer Cleaning
            * Formation of Scaled Oxides and Junctions for Deep SubMicron
            * Plastic IC Packaging:  Assembly and Reliability Issues
            * New Failure Mechanisms in SubMicron Semiconductor Devices
            * Reliability and Manufacturing Issues of ULSI Devices
            
        For more information, contact
            SPIE
            P.O. Box 10
            Bellingham, WA 98227-0010
            USA
            Phone: (206) 676-3290
            FAX:  (206) 647-1445
            In Eurpoe FAX:  47 55 96 21 75
            
----------------------------------------------------------------------------
*ITEM 2.12 THE 27th INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS.  
           (NOV 15-17, 1994, Boston, MA)  Sponsored by ISHM. 
----------------------------------------------------------------------------  
        Sessions:  
            * Modeling and CAD-I & II
            * MAM Packaging
            * Enabling Technologies for Advanced Manufacturing
            * Power Packaging
            * Thick and Thin Film
            * Emerging Technologies
            * Special Applications of the Technology
            * High Density Interconnect Technologies in Japan
            * Advances in LTCC Technology
            * Microwave Characterization of Interconnects and Packages
            * Reliability/Quality/Failure Analysis
            * Materials for High Performance Substrates
            * Sensors I & II
            * Interconnections
            * Polymer Dielectrics
            * Surface Mount Technology
            
        There will also be a variety of 'One-On-One' Presentations and
        exhibitions.
        
        Professional Development Courses:
            * Technology of Screen Printing
            * Metal Plating for Electronics
            * RF & Microwave Hybrids
            * SMT Rework and Repair
            * Understanding and Applying ISO 9001/9002
            * Known Good Die
            * Multichip Modules: The Fundamentals
            * Fundamentals of Hybrid Microelectronics
            * Failure Analysis
            * Power Hybrid Design and Fabrication
            * Design of Experiments:  Design and Analysis Strategies
              for Hybrid/MCM Manufacturing Processes
            * Laser Processing for Microelectronics
            * Clean and No Clean Options for Reliable Surface Mount 
              Assemblies
            * Wire Bond Yield and Reliability
            * BGA, The Ease of Manufacturing
            * Die Attach and Encapsulation
            * Hybrid Microelectronics:  Overview, Trends, and Issues
            * How to Handle Die
            * Getting Your Book and Technical Paper Written and Published
          
        FOR A COPY OF THE ADVANCED PROGRAM, CALL
            (800) 535-4746


            
----------------------------------------------------------------------------
*ITEM 2.13 11th IEEE MULTI-CHIP MODULE CONFERENCE  MCMC-95.  
           (Feb. 1-2, 1995, Santa Cruz, Ca  USA)  
---------------------------------------------------------------------------- 
            
        Conference Highlights:
            * Tutorials (held Jan 31)
            * Technical Sessions:  Single track designed to foster 
              interaction among chip designers, system designers, CAD tool 
              developers, adn MCM technologists.
            * Invited Talks
            * Panel Discussions
            * Exhibits:  MCM foundry, Known Good Die technology, MCM design
              tools, simulation and layout bechmark posters.
                
        For information, contact
            MCMC-95
            Attn:  Lisa Pascal
            Computer Engineering, University of California
            Santa Cruz, CA  95064
            Phone:  (408) 459-2263
            FAX:  (408) 459-4829
            e-mail:  lisa@cse.ucsc.edu
              
----------------------------------------------------------------------------
*ITEM 2.14 40th HOLM CONFERENCE ON ELECTRICAL CONTACTS.  (Oct. 17-19, 1994, 
           Chicago, Illinois  USA)  
---------------------------------------------------------------------------- 
              
        'Once again the Holm provides a forum for presenting the latest
        developments in the field of electrical contacts and the 
        application of recent advances in materials and processes 
        in electronic, electronic, and telecommunication equipment'
               (from advertisement)
               
        The following topics will be covered:
            * Contact Properties and Performance
            * Sliding Contacts
            * Connector Contacts
            * Arcing Contacts
            * Silver Metal Oxide
            * Contact Fundamentals & Testing
               
        For more information, contact IEEE at
            Phone:  (908) 562-3895
           	FAX:  (908) 562-1571
           	
----------------------------------------------------------------------------
*ITEM 2.15 3rd TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC 
           PACKAGING.  (Nov. 2-4, 1994, Monterey Plaza Hotel, CA  USA)  
---------------------------------------------------------------------------- 
        'The general subject of the metting is the electrical design, 
        analysis, and characterization of electronic interconnections
        and packaging for performance-driven, high speed/high complexity
        electronic systems.'   (from advertisement)
           
        Topics are expected to include:
               * Package analysis
               * New packaging structures
               * RF/Microwave packaging structures
               * MMIC modules and high density packaging
               * Experimental characterization methods
               * EMC/EMI effects
               * Electrical requirements
               * Novel designs and routing systems
               * Low cost, high volume packaging
               * Optoelectronic packaging
               
        For more information, 
            FAX  (602) 621-1443
            e-mail baltes@bigdog.engr.arizona.edu
               

            
----------------------------------------------------------------------------
*ITEM 2.16 1st INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS PACKAGING
           AND PCB TECHNOLOGY. (Sept 19-23, 1994, Tsinghau University, 
           Beijing, China) 
----------------------------------------------------------------------------
        'This Symposium is the first ever conference held in China 
        to address these topics and has received tremendous response
        from both industry and universities.  Lots of ground breaking
        work in the area os semiconductor manufacture technology in China
        will be discussed.  Besides the symposium presentation, round table
        meetings with Chinese business leaders and government officers 
        in semiconductor industry will also be arranged.  The working 
        language will be English.'    (from advertisement)
        
        For more information, contact
            USA:
            Anyu Lee
            2011 N. Shoreline Blvd
            M/S 12L867
            Mountainview, CA  94943-1389
            Phone:  (415) 390-2103
            FAX:  (318) 235-9435
            
            Elsewhere:
            Prof. Yu-Qin Gu
            Department of Engineering Mechanics
            Tsinghau University
            Beijing 100084, China
            FAX:  (011)-86-1-259-5569
            
----------------------------------------------------------------------------
*ITEM 2.17 BALL GRID ARRAY/FLIP CHIP WORKSHOP.  (Oct. 19-21, 1994, 
           Binghamton, NY)  Sponsored by IEEE CPMT and Binghamton CPMT.
----------------------------------------------------------------------------
        
        For information, contact
            Ron Gedney                     Don Seraphim
            General Chair                  Program Chair
            200 Old Pennsylvania Ave.      400 Pano Blvd.
            Binghamton, NY 13903            Vestal, NY 13850
            
----------------------------------------------------------------------------

*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 3     ********************************
*************                                                  **************
*************            IEEE CPMT: TC-6 News                  **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
        
----------------------------------------------------------------------------
*ITEM 3.1  TC-6 NEWS: Automotive Electronic Packaging:  
           (June 2, 1994: CPMT Newsletter).  
----------------------------------------------------------------------------
        'TC-6 is starting up an interest group in automotive electronic 
        packaging to foster communications and interactions in this rapidly
        growing area.  Note;  we spotted a number of "Big Three" attendees
        at ECTC this year.  Greg Chen is heading up this interest group.  
        For information on plans and how to contribute, contact him at 
        (414) 449-7806.'  (Les Fox, DEC (508) 493-3890 l.fox@ieee.org)
        
----------------------------------------------------------------------------
*ITEM 3.2  TC-6 NEWS: Wireless Electronic Packaging:  
           (June 2, 1994: CPMT Newsletter).  
----------------------------------------------------------------------------
        'Wireless Technology and packaging for portable electronics is a 
        hot and growing area.  Modest Iorysko at IBM is heading up a TC-6
        interest group in this field.  For information on plans and how 
        to contribute, contact Modest at (914) 945-2838.'  (Les Fox, 
        DEC (508) 493-3890 l.fox@ieee.org)
----------------------------------------------------------------------------
        
        
*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 4     ********************************
*************                                                  **************
*************        TRADE JOURNAL NEWS/ARTICLES               **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
        
----------------------------------------------------------------------------
*ITEM 4.1  NEWS: "Diamond-copper-silver alloy developed for MCM substrates"  
           (July, 1994, Solid State Technology, p 36).  
----------------------------------------------------------------------------
        'A new diamond-copper-silver composite material, developed under a 
        Cooperative Research and Development Agreement (CRADA) between 
        SUN Microsystems and Lawrence Livermore National Laboratory (LLNL), 
        may prove to be the heat sink of choice for ... MCMs because of its
        excellent thermal conduction.  In addition, the materials well-matched
        coefficient of expansion [to silicon] may make it a candidate 
        for MCM substrates.'
        
----------------------------------------------------------------------------
*ITEM 4.2  NEWS: "Sensors Used for Flaw Detection"  (June 13, 1994, 
           Electronic Design, p 27).  
----------------------------------------------------------------------------
        'By measuring the pertrurbations in spatially resolved electric fields,
        high-resolution measurements of surface and internal subsurface features,
        on either conductive or non-conductive workpieces respectively, 
        may be made with capacitance and impedance sensors. . . One sensor that
        was recently developed and evaluated, the high-resolution capacitance
        imaging sensor (HIRCIS), can generate surface images and track 
        features. . . and can detect metal burrs of less than 10 µm in height
        and chamfers ranging from 50 to 350 µm.' For more information, contact
        Jim Novak of Sandia National Laboratory at (505) 844-4427.

----------------------------------------------------------------------------
*ITEM 4.3  NEWS: hyperSPARC Processor (July, 1994, Semiconductor 
           International, p. 56)  Ron Iscoff.  
----------------------------------------------------------------------------
        'Ross Technology has unveiled a new six-chip SPARC processor packaged
        as a multichip module for the workstation market.  This, said the MCM's
        fabricator, nChip (San Jose), goes a long way toward validating MCMs
        for mainstream use. . .'

----------------------------------------------------------------------------
*ITEM 4.4  NEWS: SPARC Multichip Module Prototype  (July, 1994, Semiconductor 
           International, p. 56)  Ron Iscoff.  
----------------------------------------------------------------------------
        'An informal talk between MCC and ARPA led to a possible record
        turnaround [two weeks] for a SPARC multichip module prototype 
        [which normally takes a minimum of 2 months].'--Ron Iscoff
      
----------------------------------------------------------------------------
*ITEM 4.5  NEWS: "3-D Multichip Module to be Demonstrated"  April 4, 1994, 
           Electronic Design, p 27). 
----------------------------------------------------------------------------
        'As a result of a U.S. Air Force research-and-development contract, 
        a new type of package that incorporates varying sizes and types of
        chips and chip stacks into a single assembly will be demonstrated.
        Irvine Sensors Corp., Costa Mesa, CA, will construct what it calls 
        a multi-modular computer module (MMCM) to demonstrate its ability
        to provide manufacturers and system users with a standardized modular
        structure for high-level integration of its chip stacks.'
        
----------------------------------------------------------------------------
*ITEM 4.6 NEWS: Bare Die Pentium Ships for MCM Designs (March, 1994, 
           Computer Design, p. 26).  Mike Donlin.
----------------------------------------------------------------------------
        'In a development that's sure to give a boost to the multichip module
        (MCM) industry, Intel (Hillsboro, OR) has started shipping its Pentium 
        microprocessors in the bare die form needed for MCM designs.' 
        
----------------------------------------------------------------------------
*ITEM 4.7 ARTICLE: "Pick the Right Package for Your Next ASIC Design"  
           (Feb. 3, 1994, EDN, p. 91-108).  David P. Pivin, ASIC Division, 
           Motorola Semiconductor Products Sector.
----------------------------------------------------------------------------
        'This article focuses on packages for applications ranging from
        high-end consumer to workstation/servers and computers. . . [and]
        compares each package in a matrix of parameters detailing their cost, 
        thermal and electrical performance, physical dimensions, and ease 
        of manufacturing.'  It also includes a substantial glossary of package
        types (16 entries).

----------------------------------------------------------------------------
*ITEM 4.8 ARTICLE: CPLD Module (Cover) (April, 1994, EP&P, p. 76-78)
           Dave Bursky.
----------------------------------------------------------------------------
        Described is 'a 50-Kgate module, which combines SRAM-based CPLDs, 
        MCM technology, and a programmable interconnection chip, [to ease] 
        ASIC emulation.'
        
----------------------------------------------------------------------------
*ITEM 4.9 ARTICLE: "Circuit Material for Commerical High Frequency 
           Applications" (March, 1994, Micrwave Journal, p. 116).  Rogers Corp.
           Microwave & Circuit Materials Division, Chandler, AZ (602) 961-1382
----------------------------------------------------------------------------  
        'The performance characteristics of R03003 [developed by Rogers] 
        include uniform diaelectric constant, low loss, stable electrical 
        performance over temperature and a good dimensional stability and 
        plated through-hole reliability. . . The combination of performance
        and price makes the R03003 material ideal for commerical wireless
        applications.'
        
----------------------------------------------------------------------------
*ITEM 4.10 ARTICLE: Slow Acceptance of MCMs (March, 1994, Computer Design, 
           p. 73-76, 88-90).  Mike Donlin, Senior Editor.
----------------------------------------------------------------------------	
        A number of the barriers to the wide-use of MCMs in non-military
        industries are addressed.  They include, flexibility issues involving
        design kits (ARPA is now defining specifications), the committment
        necessary for integrated tools, exhaustive analysis of design timing, 
        thermal issues, the need for known good die, and the problem 
        of testablity.  Despite these concerns, the research in these areas
        is likely to assure designers of the advantages of more compact, and 
        higher-speed MCMs.
        
----------------------------------------------------------------------------
*ITEM 4.11 ARTICLE: Designing a four-processor SDP MCM with 3-D memory  
           (March, 1994, Computer Design, p. 77-80).  Stan Drobac, vice 
           president of products and services, nCHIP and Mike Brock, program 
           manager for MCM design at Texas Instruments.
----------------------------------------------------------------------------
        This article explains the design of the Quad C40 module in great detail.  
        'In addition to four high-leadcount processors, the module contains
        3-D memory stacks that cover nearly the entire lower substrate surface
        with connection points.  The result is a design that has a very high 
        substrate lead density compared with MCMs using the traditiona (planar)
        die orientation.'
        
----------------------------------------------------------------------------
*ITEM 4.12 ARTICLE: A Case Study of MCMs:  Three Successful Designs  
           (March, 1994, Computer Design, p. 81-84).  Tony Mazzullo, vice
           president of business development, Harris EDA.
----------------------------------------------------------------------------
        In each of the three cases explored, 'reliance on the MCM-specific
        design tool and an understanding of MCM substrate fabrication resulted
        in a fast turnaround of design prototypes for successful MCM projects.'
        Harris GCSD completed a high-yield prototype Low Temperature Cofired
        Ceramic (LTCC) module, GE developed a Class S mass memory module and 
        Integrated System Assemblies designer Nina Caporale 'used a 
        "chips-first" building technique to lay out the new Sun Super-SPARC 
        Advanced Multichip Module (AMCM).
        
----------------------------------------------------------------------------
*ITEM 4.13 ARTICLE: Glass-On-Silicon Substrate to Carry Microwave ICs  
           (June 13, 1994, Electronic Design, p 56)  David Maliniak.  
----------------------------------------------------------------------------
        'Designers at the Microelectronics Division of M/A-COM Inc., Lowell, 
        MASS., have come up with a capability called glass microwave ICs and
        discrete devices into a high-performance circuit medium that supports 
        low-cost manufacturing. . . [which] combines the low-loss attributes 
        of glass with the favorable thermal characteristics and easy-processing
        of silicon.'--David Maliniak.  For more information, contact M/A-COM
        at (508) 442-5000.
        
----------------------------------------------------------------------------
*ITEM 4.14 ARTICLE: PCMCIA: (April, 1994, Printed Circuit Fabrication, p 16-18). 
           Jerry Murray, West Coast Editor.
----------------------------------------------------------------------------
        An analysis of the market for and the companies involved in the 
        production of PC card, an industry which shows indications of growth.
        
----------------------------------------------------------------------------
*ITEM 4.15 ARTICLE: Designing a four-processor SDP MCM with 3-D memory:  
           (March, 1994, Computer Design, p. 77-80).  Stan Drobac, vice 
           president of products and services, nCHIP and Mike Brock, program 
           manager for MCM design at Texas Instruments.
----------------------------------------------------------------------------
        Describes the comblications of fabrication ultrathin PCBs in terms
        of handling, materials, processing, and warping.
----------------------------------------------------------------------------
        
        
        
*****************************************************************************
**************************  IEEE CPMT ENEWS  ********************************
**************************     SECTION 5     ********************************
*************                                                  **************
*************                    BOOKS                         **************
*************                                                  **************
*****************************************************************************
*****************************************************************************
        
----------------------------------------------------------------------------
*ITEM 5.1  "Handbook of Electronics Packaging Design and Engineering," 
           second edition by Bernard S. Matisoff. 1990. Van Nostrand Reinhold
           (656 pages)
----------------------------------------------------------------------------
     `This book provides the latest 'nuts-and'bolts' information
     on electrical interconnection systems, forced air cooling systems, 
     preferred materials, material plating and finishes, the mechanics
     of simple stresses and more.' (From Advertisement)

          Van Nostrand Reinhold
          115 Fifth Ave.
          New York, NY. 10003
          Tel: (800) 842-3636
          
----------------------------------------------------------------------------
*ITEM 5.2  "Electronic Equipment Packaging Technology" by G. L. Ginsberg.
           1993. Van Nostrand Reinhold (279 pp)  
----------------------------------------------------------------------------
     'This book explains all aspects of packaging from design to tests and 
     includes discussions on thermal management.  It describes all elements
     of an electronics package including IC's, component packages, hybrids
     and MCM's, backplanes, and electronic enclosures.'  (From Advertisement)

          Van Nostrand Reinhold
          115 Fifth Ave.
          New York, NY. 10003
          Phone:  (800) 842-3636
          
----------------------------------------------------------------------------
*ITEM 5.3  "Hybrid/MCM Technology" ed. T. L. Hodson. Cahners Publishing Co. 
----------------------------------------------------------------------------
     'As hybrid/MCM technology continues to mature, new methods of packaging, 
     fabrication, assembly and test are being developed and put to use 
     in a variety of markets.  'Hrbrid/MCM Technology' covers the progression
     of these new technologies as well as some of their applications.' 
     (From Advertisement)
   
          Cahners Publishing Co. 
          1350 E. Touhy Ave.
          Des Plaines, Il  60018
          Phone:  (708) 635-8800
          
----------------------------------------------------------------------------
*ITEM 5.4  "Surface Mount Technology for Concurrent Engineering
           and Manufacturing" by F. Classon. 1993. McGraw Hill (283 pp) 
----------------------------------------------------------------------------
     'This book goes beyond the traditional coverage of design issues and 
     covers every aspect of SMT that a company should know.  It focuses 
     on integrating multiple functions within the company -- design, 
     manufacturing, quality, testing, procruement, material control and
     management -- with special emphasis for the individuals who have SMT
     decision-making and implementation responsibilities.' 
     (From Advertisement)
   
          McGraw Hill
          11 W. 19th St
          New York, N.Y.  10011
          Phone:  (212) 337-5945
  
----------------------------------------------------------------------------
*ITEM 5.5  "Compendium on Electronic Packaging" ed. D. E. Swanson. 1993. 
           Cahners Publishing Co. 
----------------------------------------------------------------------------
     '[This book] os a helpful reference for those involved in the design 
     and manufacture of wlectronic packages.  The publication provides novel
     solutions in the areas of cooling, attachment, connection and 
     interconnection, among others.'  (From Advertisement)
   
          Cahners Publishing Co.
          1350 E. Touhy Ave.
          Des Plaines, Il  60018
          Phone:  (708) 635-8800
          
----------------------------------------------------------------------------
*ITEM 5.6  "Multichip Module Technologies and Alternatives: The Basics" 
           ed. D. A. Doane and P. D. Franzon. 1993.  Van Nostrand Reinhold 
           (875 pp).
----------------------------------------------------------------------------
     'This book examines four MCM prespectives -- materials, manufacturing,
     systems performance and cost requirements -- with an emphasis
     on decision making.  It discusses examples of MCMs and the products 
     and systems in which they have been used; examples of equipment; 
     and processes used to design, build and test MCMs.'  
     (From Advertisement)
   
          Van Nostrand Reinhold
          115 Fifth Ave.
          New York, NY. 10003
          Phone:  (800) 842-3636
          
*****************************************************************************
*                            END OF NEWSLETTER                              *
*                                                                           *
*         PACKAGING AND INTERCONNECTION ELECTRONIC NEWSLETTER               *
*                                                                           *
*                          Volume 1, Number 3                               *
*                           August 24, 1994                                 *
*****************************************************************************