CPMT INFORMATION
CONFERENCES AND WORKSHOPS
CALL FOR PAPERS
THE THIRD VLSI PACKAGING WORKSHOP OF JAPAN
December 2-4,1996
Kyoto Kokusai Hotel, Kyoto, Japan
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Submitted by:
Les Fox
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Sponsored by:
* IEEE Components Packaging and Manufacturing Technology Society
* National Institute for Standards and Technology
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INFORMATION
The IEEE CPMT Society and the National Institute for Standards and
Technology are jointly sponsoring the Third VLSI Packaging Workshop of
Japan to be held in Kyoto. The speed and pin counts of VLSI packages
continue to increase. The VLSI packages must be electrically and
thermally enhanced to keep up with the VLSI silicon advances. They are
also required to be as small as possible, higher in performance and
lower in cost to meet system requirements for the Multimedia Age.
The goal of this Workshop is to accelerate "the Interaction" among
experts and leaders in various packaging areas of material,
components, assembly prosesses, manufacturing equipment and package
design for the 21st century. All attendees are expected to be
specialists in the fields. The workshop will be held in English.
Speakers will be allowed 30 minutes for their presentations.
TOPICS OF INTEREST: Papers are solicited from these technical areas:
o Portable and Hand-held Electronics Applications
o Area Array Packaging: Ball Grid Array(BGA) and Chip Scale Package(CSP)
o Microprocessor Packaging
o High-density Memory Packaging
o MCM, KGD, 3D Packaging
o Wire-bonding, TAB, ACF, Flip-chip Assembly Technology
o Components, Solidering and Die-attachment
o New Materials and Processing
o Electrical/Thermal/Mechanical Modeling and Characterization
o High-speed/High-frequency Design and CAD
o Reliability Physics and Chemistry
PAPER SUBMISSION:
Submit a 300-word abstarct describing the scope, contents, and the
major points of the paper. Included up to four key figures along with
paper title, name, affiliation, address, phone/facsimile number and
e-mail address. Send twelve copies of the abstract in time to be
received by June 21, 1996.
Send to:
Yoichi Kohara
LSI Packaging Engineering Dept.
OKI Electric Industrial Co.,Ltd.
550-1, Higashi-Asakawa-cho, Hachioji, Tokyo 229, Japan
Phone: +81-426-62-6635, Fax: +81-426-63-4215
E-mail: kohara@hac.oki.co.jp
Authors of selected papers will be notified by August 31, 1996.
For more information feel free to contact any Committee Member for the
Kyoto VLSI Packaging Workshop '96.
General Chaiman:
Toshio Sudo, TOSHIBA : tsudo@sdl.rdc.toshiba.co.jp
Vice Chairman:
George Harman, NIST : harman@apollo.eeel.nist.gov
Kenzo Hatada, Matsushita : hatada@vtrl.src.mei.co.jp
Past Chairman:
Kanji Otsuka, Meisei Univ. : otsuka@ei.meisei-u.ac.jp
Japanese Committee:
Hiroshi Shibata, Mitsubishi : shibata@iot.melco.co.jp
Nobuo Kamehara, Fujitsu : nkameha@flab.fujitsu.co.jp
Tomoshi Ohde, Sony : ohde@ms.semicon.sony.co.jp
Yoichi Kohara, Oki : kohara@hac.oki.co.jp
Atsushi Nakamura, Hitachi : nakamua@qm.musashi.hitachi.co.jp
Kenji Furuya, NEC : k_furuya@lsi.tmg.nec.co.jp
Fuminori Ishitsuka, NTT : ishi@aela.ntt.jp
Hisashi Tomimuro, NTT Ele. Tech. : tomimuro@atsu.nel.co.jp
Lee Hyung-Woo, Anam Japan : Fax; +81-462-48-8733
Dennis R. Olsen, Nippon Motorola Ltd.: d.olsen@ieee.org
/RBVJ60@waccvm.corp.mot.com
US Committee:
John W. Balde, IDC : balde@mcimail.com
Eugene Rymaszewski, RPI : generym@unix.cie.rpi.edu
Les Fox, Digital Equip. Corp. : l.fox@ieee.org /fox@mroa.ENET.dec.com
Iwona Turlik, Motorola : AIT001@email.mot.com
John L. Prince, Univ. of Arizona : prince@ece.arizona.edu
Elaine Pope, Intel : d_elaine_pope@ccm.hf.intel.com
Bill Hamburgen, Digital Equip. Corp. : billh@pa.dec.com
European Committee:
Karel Kurzweil, Bull, France : Paci-srv@frcl.bull.fr
Hans Hentzell, Linkoping Univ., Sweden : Fax; +46-13-21-37-24
Gerard Nicolas, LETI, France : Gerard NOCOLAS@macmel.ceng.cea.fr
Herbert Reichl, Tech. Univ. of Berlin, Germany : Fax; +49-30-314-72835
Carlo Cognetti, SGS-Thomson, Italy : Fax; +39-39-603-5050
Asian Committee:
Albert W. Lin, ITRI/ERSO, ROC : 820126@itrioa1.itri.org.tw
Jung-Ihl Kim, Anam, Korea : Fax; +82-2-460-5462
Kyung-Wook Paik, KAIST, Korea : kwpaik@sorak.kaist.ac.kr
Thiam-Beng Lim, National Univ. of Singapore : tblim@carerras.ime.gov.sg
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CALL FOR PAPERS
Nineteenth (1996) IEEE/CPMT
International Electronics Manufacturing Technology Symposium
October 14-16, 1996
Austin, TX USA
"Manufacturing Technologies for a Global Economy"
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Submitted by:
Les Fox
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Sponsored by:
* IEEE Components Packaging and Manufacturing Technology Society
* Semconductor Equipment & Materials International (SEMI)
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INFORMATION
The IEMT is an international forum for the presentation of research,
development and applications of manufacturing technology for
electronic components, assemblies and systems. The Symposium is held
each fall in the United States, and every other year in Japan.
The IEMT is an information forum for all those involved in the
development and improvement of electronics manufacturing technologies.
It features technical sessions, panels, and opportunities to meet with
the experts on leading-edge work in the area.
The 1996 Symposium will run concurrently with Semicon Southwest in
Austin, Texas, providing an opportunity to view the most recent
manufacturing equipment.
TOPICS OF INTEREST: The Symposium is now soliciting technical
papers on current work in the areas listed below.
Manufacturing Operations Improvement
- Integrated Design and Manufacturing
- Manufacturing Management Worldwide--Europe, Asia and Emerging
Suppliers
- System Quality and Product Integrity
Advanced Interconnect Manufacturing
- Flip-chip and Fine-pitch Interconnection
- High-density Substrates
- Manufacturing Issues in Ball Grid Array and Chip Size Packages
- Manufacturing with Known Good Die
- Manufacturing 3-D Packages
- Display Manufacturing and Packaging
Semiconductor Manufacturing
- Semiconductor Minifabs
- Semiconductor Processes
- Manufacturing Analysis
- Operational Modeling
Process Modeling and Control
- Statistical Methods to Reduce Manufacturing Costs
- Manufacturing Defect Analysis
- Cost Modeling
- Reducing Manufacturing Cost
- Manufacturing Management to Reduce Cycle Time and Cost
- Advanced Scheduling
- Low-cost Opto-electronic Manufacturing
Emerging Technologies in Manufacturing
- Design for Environment
- Intelligent Manufacturing
- Late-breaking News on Emerging Technologies
SUBMISSION:
Deadline for receipt: March 17, 1996
Mail, FAX, or Email to:
Gail Wesling, Publications
12250 Saraglen Drive
Saratoga, CA 95070 USA
Phone: 408-257-5702
Fax: 408-285-9670
email: g.wesling@ieee.org
Please include the following:
Name(Dr/Mr/Ms)
Paper Title
Author and co-authors
Company/Institution
Address
Phone, FAX, E-Mail
* * * Please note * * *
Most IEMT correspondence is conducted electronically.
Make sure to send your correct FAX and/or email numbers.
To submit a paper, send an abstract of at least 250 words by March 17,
1996. It must clearly describes the nature, scope, content,
organization, key points and significance of the proposed paper. The
paper must consist of work or results not published previously.
Submission of an abstract represents a commitment to submit a cleared
manuscript by June 30, 1996. It also represents a commitment to
either attend the conference or send a knowledgeable substitute who
can answer questions regarding the reported work. It is the author's
responsibility to obtain internal company approvals consistent with
these deadlines.
Authors will be notified of paper acceptance by April 30, 1996.
Camera-ready manuscripts are expected to be from three to eight pages
including diagrams, figures, and photographs. As a convenience,
authors may pay a fee to have our subcontractor format the text and
figures. Additionally, they offer editing services to authors for
whom English is a second language. Authors need only submit text on
diskette or email together with photos and figures.
Copies of your paper may be shown to members of the technical press
for pre-conference publicity. They may chose to quote up to 50 words
from your paper and publish your figures and diagrams. If this would
create a problem for your company, please tell us when you submit an
abstract.
The language for the Symposium and its publications is English. The
IEMT Symposium is sponsored by the IEEE; however, IEEE membership is
not required to present a paper or to attend the Symposium. Copies of
past IEMT proceedings are available for purchase. Papers published in
the Proceedings are eligible for publication in the IEEE CPMT
Transactions after peer review.
General Chairman:
E. Jan Vardaman
TechSearch Int'l
9430 Research Blvd, Bldg. 4, #400
Austin, TX 78759 USA
Phone: 512-343-4508
FAX: 512-343-4509
Email: 3123566@mcimail.com
Program Chairman
Linda Matthew
LSI Logic Corp.
1501 McCarthy Blvd
Milpitas CA 95035
Phone: 408-954-4884
Fax: 408-433-7241
Email: l.matthew@ieee.org
Japan Liaison
Dr. Takaaki Ohsaki
NTT Interdisciplinary Research Labs
9-11, Midori-cho 3-chome
Musashino-shi, Tokyo, 180 JAPAN
Phone: 81-422-59-3230
Fax: 81-422-60-7824
Email: mika@aela.ntt.jp
Taiwan Liaison
Dr. Li-Chung Lee
ITRI, Matl's Research Lab
Bldg. 77, 195 Chung Hsing Rd., Sec. 4
Chutung, Hsinchu, Taiwan 31015
Phone: 886-35-820250
Fax: 886-35-820262
Europe Liaison
Michel Salagoity
Solectron France
BP 6, Chemin departemental 109E
33611 Cestas, Cedex, FRANCE
Phone: 33-56-75-7470
FAX: 33-56-89-8136
Past Conference Publications
Paul Wesling
Tandem Computers
10400 Ridgeview Court, LOC 208-57
Cupertino, CA 95014 USA
Phone: 408-285-9555
FAX: 408-285-9670
Email: p.wesling@ieee.org
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Call for Papers
International Conference on Computer Design
ICCD '96
Omni Hotel, Austin, Texas
October 7-9, 1996
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Submitted by:
Donatella Sciuto
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Sponsored by:
* IEEE Circuits and Systems Society
* IEEE Computer Society
In Cooperation with
* IEEE Electronic Devices Society
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INFORMATION
ICCD covers all aspects of the design and implementation of VLSI
computer and processor systems. The multi-disciplinary nature of the
conference is intended to emphasize the interactions among architecture,
networking, computer-aided design, design & test, technology and
embedded computing. Up-to-date information on ICCD '96 is available on
the World Wide Web---you can find the ICCD '96 home page at
http://www.ee.princeton.edu/~wolf/iccd-96.html.
TOPICS: Original papers are solicited in the following areas:
(1) Data Communications and Networks
Gigabit networks, workstation cluster interconnects, multiprocessor or
multicomputer interconnects, local-area and wide-area networks,
routing and protocols, scalability and reliability issues, workload
characterization, and network applications. Performance evaluation
and design of network interfaces, networks, chip sets.
(2) Embedded Systems
Innovative embedded systems, including automotive, medical, machine
control, robotics, telecommunications, or any other electronic or
computer-based systems. Design techniques for embedded systems
including hardware-software co-design, compilation and parallel
programming techniques for embedded systems, performance analysis,
design methodologies.
(3) Technology
State-of-the-art system integration, packaging, wafer-scale
integration. ASIC, gate array and FPGA architectures. Environmental
factors. Optical Interconnects. VLSI:CMOS, bipolar, GaAs, low
temperature, mixed technologies. Storage: optical, magnetic,
semiconductor.
(4) Architecture & Algorithms
Advanced computer architecture. Microprocessor design, signal and
image processors, graphics processors. Architectural support for
operating systems and languages. Cache and memory systems.
Intelligent machines. Computer arithmetic. Design and analysis of
algorithms, parallel algorithms, numerical methods, system design
methods, performance measurement.
(5) Design & Test
Mixed analog/digital design and test, design and test of digital
circuits and arrays and cellular structures, self-timed designs,
synchronization strategies, clock distribution schemes, arbiters,
controllers. Design for multiple factors as testability, speed, power,
area, reliability, tradeoffs between factors, and economic issues.
Reliable computing, system test, system performance evaluation.
Concurrent engineering methodologies, system partitioning issues.
(6) Computer-Aided Design
High-level timing issues. FPGA design and support. Design of
multi-chip modules. Asynchronous design. Formal verification.
High-level synthesis. Silicon compilation. Automatic layout, placement
and routing, layout verification. Timing analysis. Logic and circuit
simulation. Multiprocessor and parallel processing. Implementation of
CAD algorithms. Dedicated CAD hardware. Integrated CAD systems.
Papers which describe innovative features of new products, and which
describe the overall integration of these six areas into the computer
design process are of particular interest for ICCD. Awards will be
presented to the best conference papers in each technical area.
Instructions to Authors:
Prospective authors are invited to submit a draft version or a full
paper of at least 2000 words but not longer than 20 double spaced pages.
The submission should include key ideas and results: (a) a clear
description of the contribution and why it is important, (b) for
original research submissions state what is novel about the
contribution, (c) for review and tutorial submissions state the
contribution to the multi-disciplinary mission of the conference.
While contributions must be submitted in paper form, as much as possible
of the correspondence relating to submissions will be conducted by
electronic mail.
Submission and schedule information
- 6 copies of the contribution
- Authors names, affiliations, addresses, e-mail, telephone, and fax
numbers
- In the case of multiple authors please indicate the corresponding
author
- The appropriate area for review among
1. Data Communications and Networks
2. Embedded Systems
3. Technology
4. Architecture & Algorithms
5. Design & Test
6. Computer-Aided Design
IMPORTANT DATES
- Submissions must be received by March 4, 1996
- Notification of acceptance will be given on May 1, 1996
- Final manuscript is due on June 30, 1996
Submissions should be sent to the Technical Program Chair.
Technical Program Chair
Prof. Jacob Abraham
Computer Engineering Research Center
The University of Texas at Austin
ENS 424
Austin, TX 78712-1014 USA
Phone: 512 471 8983
Fax: 512 471 8967
E-mail: iccd96@cerc.utexas.edu
Proposals for specially organized sessions and tutorials
are also solicited. They should be received BEFORE the regular papers, by
February 19, 1996.
General Chair
Wayne Wolf - Princeton University
Technical Program Chair
Jacob Abraham - University of Texas at Austin
Technical Program Vice-Chair
Bing Sheu - University of Southern California
Architectures and Algorithms track chair
Pen Yew - University of Minnesota
CAD track chair
Luc Claesen - IMEC
Design and Test track chair
Magdy Abadir - IBM
Networking and Data Communications track chair
John Trotter - AT&T Bell Laboratories
VLSI & Technology track chair
Kit Cham - HP Labs
Embedded Systems track chair
Rolf Ernst - University of Braunschweig, Germany
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CALL FOR PAPERS
1996 AIChE Annual Meeting
Topical Conference Chicago 96
on Processing, Structure and Properties of Polymers
November 11-14, 1996
Polymeric Thin Films and Interfaces:
Processing and Orientation Effects
sponsored by Area 8a
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Submitted by:
Michael A. Schen
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The formation of polymeric thin films is of great relevance in a number
of applications ranging from adhesive interlayers to optically
functional devices. The means by which such films are formed and
processed determines surface and interfacial properties of the film,
as well as macro- and microscopic ordering. Of particular interest are
interfacial and surface effects on microscopic or macroscopic order,
characterization of these effects, and process-structure-property
relationships in the systems. Papers describing investigations of
films ranging in thickness from nanometers to several microns are
solicited. Areas of interest include:
* Processing Techniques for Ultrathin Organic Polymer Films
* Molecular Orientation Effects
* Polymer Flow or Annealing Effects
* Polymer Adsorption Processes
Proposal-to-Present forms are available from the chairs, and should be
submitted (with Extended Abstract) by March 15, 1996.
Chair: Co-Chair:
Paula T. Hammond Hilary S. Lackritz
Dept. of Chemical Engineering Dept. of Chemical Engineering
Massachusetts Institute of Technology Purdue University
Cambridge, MA 02139 West Lafayette, IN
47907-1283
Phone: (617)258-7577 Phone: (317)494-4065
Fax: (617)258-8224 Fax: (317)494-0805
hammond@mit.edu lackritz@ecn.purdue.edu
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Call For Papers
Advanced Technology Workshop on Wireless Communications
Clarion Harvest House
Boulder, Colorado
August 21-23, 1996
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Submitted by:
Roger Marks
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General Chair:
Dr. Roger Marks
National Institute of Standards and Technology
r.b.marks@ieee.org
Technical Chair:
Dr. Modest Oprysko
IBM T. J. Watson Research Center
modest@watson.ibm.com
INFORMATION
The pace of the wireless revolution threatens to overwhelm not only
consumers but engineers as well! Whether working with systems, active
or passive components, packaging, antennas, or EMI, engineers have a
limited exposure to other fields which make up their industry.
This second annual workshop, now sponsored by the IEEE Microwave Theory
and Techniques Society and the IEEE Components, Packaging, and
Manufacturing Technology Society as well as by the International
Society for Hybrid Microelectronics (ISHM), offers an opportunity to
present new ideas in a wide variety of wireless technologies. At the
same time, it will emphasize a broad, integrated view. Participants are
asked to think about and speculate on the future evolution of the
industry. A special session will offer the opportunity to roadmap the
wireless future and itemize technical priorities for industry,
academia, and governments.
The conference will be held in a relaxed atmosphere at the foot of the
Rocky Mountains. The National Institute of Standards and Technology will
offer the opportunity to tour its RF and microwave network and
materials measurements laboratories as well as antenna and
electromagnetic interference test ranges.
TOPICS: Papers are primarily solicited in the following fields:
-wireless systems
-RF packaging, interconnects, and substrates
-active RF components
-passive RF components
-antennas, propagation, and electromagnetic interference
-measurements
-modeling tools
In keeping with the informal and timely nature of the workshop, one one-
or two-page summaries will be printed and distributed. The will be due on
August 1, 1996.
Please submit abstracts for consideration, clearing stating the
significance of the techncial work, by April 1, 1996 to the Technical
Chair:
Dr. Modest Oprysko
IBM T. J. Watson Research Center
P. O. Box 218
Yorktown Heights, NY 10598
phone: 1-914-945-2838
fax: 1-914-945-1974
modest@watson.ibm.com
For additional information, please contact the General Chair:
Dr. Roger Marks
National Institute of Standards and Technology
325 Broadway, MC 813.06
Boulder, CO 80303
phone: 1-303-497-3037
fax: 1-303-497-7828
marks@nist.gov
Technical Program Committee:
Mr. Greg Caswell, Galaxy Microsystems, Inc., Austin, TX
Dr. Kari-Pekka Estola, Nokia Research Center, Helsinki, Finland
Dr. Michael Golio, Motorola SPS, Tempe, AZ
Mr. Donn T. Harvey, Boeing Areospace and Electronics, Seattle, WA
Dr. Bent Hessen-Schmidt, Noise Com, Paramus, NJ
Mr. Michael Heutmaker, AT&T Bell Laboratories, Princeton, NJ
Dr. Charles Huang, Anadigics, Inc., Warren, NJ
Mr. Anil Kripalani, Qualcomm, Inc., San Diego, CA
Dr. Mali Mahalingam, Motorola SPS, Tempe, AZ
Dr. Roger Marks, National Institute of Standards and Technology, Boulder,
CO
Dr. Modest Oprysko, IBM T. J. Watson Research Center, Yorktown Heights,
NY
Mr. Richard Perko, M/A-COM Corporate R&D Center, Lowell, MA
Dr. Saila Ponnapalli, IBM T. J. Watson Research Center, Yorktown Heights,
NY
Dr. Tom Reynolds, Murata Electronics North America, Inc., Smyrna GA
Mr. Hitoshi Takanashi, NTT Wireless Systems Laboratories, Kanagawa-ken,
Japan
Mr. Chandler C. Tedholm, AT&T Network Systems, Whippany, NJ
Prof. Vijai Tripathi, Oregon State University, Corvallis, OR
to be announced, Philips N.V.
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CALL FOR PAPERS
5th Topical Meeting on Electrical Performance of Electronic Packaging
EPEP'96
October 28 - 30, 1996
Napa, California
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Submitted by:
Alina Deutsch
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Sponsored by:
* The IEEE Microwave Theory and Techniques Society
* The IEEE Components, Packaging and Manufacturing Technology Society
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C0-Chairs:
* A. Deutsch, IBM Corporation
* V.K. Tripathi, Oregon State University
TOPICS OF INTEREST
The general subject of the meeting is the electrical design, analysis,
and characterization of electronic interconnections and packaging
structures for performance-driven, high speed/high complexity
electronic systems. A forum will be provided for the discussion of the
following topics as they relate to chip-to-chip and on-chip
interconnections in electronic systems:
* PACKAGE ANALYSIS, INCLUDING NUMERICAL METHODS AND ALGORITHMS;
ELECTRO-MAGNETIC ANALYSIS TOOLS; ADVANCES IN TRANSMISSION-LINE
TECHNIQUES.
* NEW AND INNOVATIVE INTERCONNECT AND PACKAGING STRUCTURES AND
THEIR ELECTRICAL PERFORMANCE.
* RF/MICROWAVE PACKAGING STRUCTURES AND THEIR ELECTRICAL PERFORMANCE.
* MMIC MODULES AND HIGH DENSITY PACKAGING.
* EXPERIMENTAL CHARACTERIZATION TECHNIQUES AND TESTING PROCEDURES.
* EMC/EMI EFFECTS; PREDICTION AND MEASUREMENT OF RADIATION FROM
INTER-CONNECT STRUCTURES AND PACKAGED SYSTEMS.
* ELECTRICAL REQUIREMENTS, LIMITS OF PERFORMANCE.
* NOVEL DESIGNS, DESIGN METHODS, WIRE PLACEMENT AND ROUTING SYSTEMS.
* LOW COST, HIGH VOLUME PACKAGING
* OPTOELECTRONIC PACKAGING; STRUCTURE AND SYSTEM APPLICATIONS.
* PACKAGING CONCERNS FOR WIRELESS COMMUNICATION; DESIGN AND MODELLING.
* CURRENT AND FUTURE ISSUES RELATED TO ON-CHIP INTERCONNECTIONS;
PERFORMANCE LIMITS, INTERCONNECT SCALING, PARAMETER EXTRACTOR AND
PERFORMANCE EVALUATION TOOL DEVELOPMENT.
BACKGROUND INFORMATION
This is the fifth meeting in this topical series. The last meeting had
a record attendance and was held in Portland, Oregon, during
October 2 - 4, 1995.
Additional information may be obtained from the conference co-chairs:
Vijai Tripathi - e-mail: vkt @ ece.orst.edu, phone: (503) 737-2988,
FAX: (503) 737-1300 or
Alina Deutsch - e-mail: deutsch @ watson.ibm.com,
phone: (914) 945-2858, FAX: (914) 945-2141.
Copies of the 1995 meeting's digest can be obtained from IEEE by
requesting the publication catalog number 95TH8137 at
phone: (908) 981-0060 or FAX: (908) 981-0027.
PAPER SUBMISSION
Authors are invited to submit papers describing new technical
contributions in the areas broadly covered above. The original and
three copies of a summary, not to exceed three pages, including
illustrations, are required for paper selection. All papers must be
written in English. The title of the paper and the names and
affiliations of all the authors including complete mailing address,
telephone , FAX number and e-mail, must appear on the first page of the
summary, as well as a 35-word abstract. FAX and e-mail are absolutely
necessary since all paper acceptance notifications and further
communications will be done via one of these media. If the paper is
accepted, the summary will be reproduced, as is, in the meeting's
digest. An IEEE transfer of copyright, found in most IEEE journals,
must accompany each submission.
DEADLINE FOR SUBMISSION
Submission should be sent, no later than JULY 1, 1996, to the address
below.
EPEP'95
Engineering Professional Development
University of Arizona
Box 9, Harvill Building, Room 235
Second and Olive Streets
Tucson, Arizona 85721-0076
(520) 621-3054
FAX: (520) 621-1443
e-mail: baltes@bigdog.engr.arizona.edu
SHORT COURSES will be offered October 27, 1996, the Sunday before
the start of the conference. Proposals or suggestions for these courses
should be submitted to the co-chairs by April 26, 1996.
PRODUCT AND ADVERTISEMENT DISPLAYS
Parties interested in displaying products and software packages at this
meeting should contact the address below.
Individual company sponsorship of the breaks is greatly appreciated and
facilities are provided for displaying advertising material.
CONFERENCE LOCATION
The conference will be held at the Inn at Napa Valley in the
picturesque wine producing Napa Valley area which is easily accessible
from San Francisco or Oackland airports within one hour drive or bus
ride. A short wine cellar tour will be provided in the afternoon of
October 29.
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CALL FOR PAPERS
Fifth Annual Advanced Technology Workshop
ATW'96"
* THE EUROPEAN PART: July 8-10, 1996
Hosted by: Institut National des Sciences Appliquies de Toulouse,
France
MAIN TOPIC: Advanced Technology and Economical Constraints
* THE U.S.PART: August 7-9, 1996
Hosted by: Electronic System Center, US Air Force
Hanscom Air Force Base, Bedford, Massachusetts, USA
MAIN TOPIC: Commercialization of Research
---------------------------------------------------
Submitted by:
---------------------------------------------------
Objectives:
The purpose of ATW'96 is to provide a forum for engineers,
researchers, and managers in the U.S. and Europe to exchange concepts
and methodologies for the application of advanced technologies to real
world applications. The topics addressed should focus on the different
levels of technology applications from research to productization and
finally commercialization. The overall structure of the workshop
parallels a formalized engineering approach which encompasses the many
disciplines involved in development and applications of advanced
technologies, from basic engineering, microsystems design, computer
science, business and management. The goal is to identify better
communication and education strategies among decision makers,
designers, and academic faculty to achieve a comprehensive understanding
of the impact collaborative engineering and co-design practices have on
the final product. And in addition, it will provide a workforce
sensitive to customer needs. An integral part of ATW96 is also to
facilitate insight into future research directions with special emphasis
on manageability of quality and reliability due to the emerging
complexity of new technologies and design methodologies.
Topics of Interest at the workshop include, but are not limited to:
------------------
DESIGN ISSUES
* Co-Design
* Collaborative Engineering
* Embedded Systems
* Human Interfaces
* Automated Tools
QUALITY ISSUES
* Test Issues
* Reliability
* Maintainability
* ISO 9000 and TQM
* Accelerated Testing
TRANSFER ISSUES
* Cooperative Agreements
* Transfer Mechanisms
* Re-Engineering the Institution
* Products and Markets
* Commercialization of Research
PAPER SUBMISSION
Send a paper to the ATW Chair of the part you want to participate in:
* EUROPE:
Dr. Claude Baron, Chair of ATW'96 EUROPE
INSA-DGE, LESIA
Institut National des Sciences Appliquies de Toulouse
Complexe Scientifique de Rangueil, 31077 Toulouse,Cedex, France
phone: (33) 61 55 98 99
fax: (33) 61 55 98 00
email: atw@ insa-tlse.fr
* US:
Dr.Barbara Dziurla-Rucinska, Program Chair of ATW'96 US
Dept. of Electrical&Computer Engineering
University of New Hampshire, Durham, New Hampshire 03824, USA
phone: (603) 862-3729
fax: (603) 862-1832
email: barbara.rucinska@unh.edu
IMPORTANT DATES
ATW'96 EUROPE ATW'96 US
Papers Due: April 1, 1996 May 1, 1996
Notification of Acceptance: May 1, 1996 June 1, 1996
Discounted Registration: June 10, 1996 July 1, 1996
ATW'96 Steering Commitee:
-------------------------
C. Baron, INSA-DGE, LESIA, France
D. Boutin, Loockhead Martin, USA
A. Rucinski, Univ. New Hampshire, USA
J-F. Santucci, Univ. Corse, France, General Chair
R. Straitt, US Air Force, USA
ATW'96 Program Commitee:
------------------------
GENERAL CHAIR: J-F. Santucci, Univ. Corse, France
CO-CHAIRS:
C. Baron, INSA-DGE, LESIA, France
R. Straitt, USAir Force, USA
PROGRAM-CHAIRS:
B. Dziurla-Rucinska, Univ. New Hampshire, USA
P. Sanchez, Univ. Cantabria, Spain
P. Arato, Techn. Univ. Budapest, Hungary
P. Bisgambiglia, Univ. Corsica, France
W. Ellis, Software Process and Metrics, USA
D. Erbschloe, US Air Force, USA
M. Filippi, Univ. Corsica, France
D. Forrest, Univ. New Hampshire, EOS, USA
J-C. Geffroy, INSA-DGE, LESIA, France
P. Girard, Univ. Montpellier, LIRMM, France
J. Gueller, Texas Instruments, USA
R. Hermida, Univ. Complutense, Spain
D. Hummer, Univ. Duisbourg, Germany
W. Jaworski, Concordia University, Canada
H. Joiner, SRC, Inc., USA
G. Motet, INSA-DGE, LESIA, France
B. Straube, FhGIIS, Germany
S. Tewksbury, Univ. West Virginia, USA
**************************************************
ATW'96 EUROPE Information
July 8-10, 1996, INSAT- Toulouse, France
Title:
Advanced Hardware/Software Technology and Economical Constraints
Objectives:
In the framework of the general ATW'96 theme, the European part
offers a forum to discuss the latest developments in advanced
hardware/software technology, key feature of economical competition,
and their applications in various domains: aeronautics and space,
telecommunications, medical equipments, etc. Advanced Technology
concerns new products, new design and development methods, and new
communication means. It requires new forms of cooperation, application
driven enterprise, and teaming approches. Special attention will be paid
to the influence of economical constraints on Research, Industry as well
as Education. The aim of this workshop is to bring together specialists
facing these questions: Ph.D. students, engineers, researchers,
managers, etc.
Topics:
1. Advanced H/S Technology: means used to increase system quality during
the design phase and the evaluation phase (test, metrics,
simulation, etc.).
2. Advanced Technology application to embedded systems:
aeronautics & space, communications, medical equipment, etc.
3. Collaboration between research, industry and development agencies.
4. Education: new decentralized means (networks e.g. Internet) and
cooperative methods.
The previous proposed list of topics is not an exhaustive one.
Are welcomed papers dealing with:
. theoritical studies,
. practical (technical or pedagogical) experiments,
. demonstrations.
We would appreciate papers considering the economical constraints (costs
and benefits) on the use of new advanced technology.
Ph.D. student contributions are encouraged as well as presentation of
merged working initiatives between research and industrial laboratories,
companies and other institutions.
Submissions:
manuscripts must be sent before April 1 to:
Dr. Claude Baron, Chair of ATW'96 EUROPE
INSA-DGE, LESIA
Institut National des Sciences Appliquies de Toulouse
Complexe Scientifique de Rangueil, 31077 Toulouse,Cedex, France
phone: (33) 61 55 98 99
fax: (33) 61 55 98 00
email: atw@ insa-tlse.fr
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CALL FOR PAPERS
1996
MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS
August 18-21, 1996
Iowa State University
Ames, Iowa
USA
For up-to-date information please see:
http://www.ee.iastate.edu/~russell/midwest_c_and_s/homepage.html
or e-mail to: mwscas96@iastate.edu
---------------------------------------------------
Submitted by:
Marwan Hassoun"
---------------------------------------------------
Sponsored by:
* IEEE Circuits and Systems Society
---------------------------------------------------
The 1996 Symposium is sponsored by the IEEE Circuits and Systems Society.
The Symposium will be devoted to all aspects of the theory, design, and
applications of circuits and systems.
Major Technical Tracks
1. VLSI
2. CAD
3. Neural Networks
4. Modeling and Simulation
5. Signal Processing
6. Circuits
7. Systems
8. Applications
Suggested Topic Areas
Analog Circuits Filters
Analog Signal Processing Fuzzy Systems
Biomedical Systems Genetic Algorithms
CAD Image Processing
Communications Microwave Circuits
Computer Networks Neural Networks
Control Systems Nonlinear Circuit and Systems
Digital Circuits Power Electronics
Digital Signal Processing Power Systems
Electromagnetics Robotics
Expert Systems
AUTHOR GUIDELINES
The organizing committee invites prospective authors to send five (5)
copies of a 1000-word summary of the proposed paper. Also, on a
separate sheet of paper, send a 50-word abstract for inclusion in the
technical program if the paper is accepted. Instructions for
preparation of summaries and abstracts are as follow:
FORMAT FOR SUBMISSION OF PAPER SUMMARY
Please include the following in sequence:
Paper Summary (1000 words)
Author Information
(Please include complete mailing address,
telephone, FAX number, e-mail address.)
Audio/Visual Equipment Required
(Overhead Projector, Slide Projector, VHS VCR/Monitor,
PC/Monitor/Projector, Mac/Monitor/Projector)
FORMAT FOR SUBMISSION OF ABSTRACTS
Please include the following in sequence:
Technical Track
Topic
Abstract (50 words)
Author Information
Paper submissions should be addressed to the Technical Committee Chair,
Dr. Michael Soderstrand, at the symposium correspondence address.
SPECIAL SESSIONS
The organizing committee invites you to propose and organize a special
session for the 1996 Symposium. A proposal for the Special Sessions
should include the proposed title of the special session, a statement
describing the technical importance and relevance of the session,
organizer's name, mailing address, telephone, Fax, and e-mail. The
proposal should also include, for each proposed paper, a title,authors'
information, and a short abstract. Mail two (2) copies of the proposal
to the Special Sessions Chair, Dr. Vijay Vittal, at the symposium
correspondence address no later than February 9, 1996.
TUTORIALS
The Symposium will hold a full day of tutorials on Sunday, August 18.
Proposals for full-day and half-day proposals and any questions should
be addressed to the Tutorials Chair, Dr. John Doherty, at the symposium
correspondence address no later than November 15, 1995.
EXHIBITS
Exhibitors are welcome. Please address all questions regarding
exhibits to the General Chair, Dr. Marwan Hassoun, at the symposium
correspondence address.
SYMPOSIUM CORRESPONDENCE ADDRESS
Please address all correspondence to the particular chair at:
Extended and Continuing Education
102 Scheman Building
Iowa State University
Ames, Iowa 50011-1112
Telephone: 515-294-6229
Fax: 515-294-6223
E-mail:mwscas@iastate.edu
SYMPOSIUM HOME PAGE
You may also access this and other symposium information as it becomes
available on the World Wide Web. The URL for the symposium homepage is:
http://www.ee.iastate.edu/~russell/midwest_c_and_s/homepage.html
DEADLINES
Tutorial Proposals Postmarked November 15, 1995
Special Session Proposals Postmarked February 9, 1996
Paper/Abstract Submission Postmarked February 9, 1996
Paper Notification May 3, 1996
ORGANIZING COMMITTEE
General Chair - Marwan Hassoun, ISU
Technical Program Chair - Michael Soderstrand, UC-Davis
Special Sessions Chair - Vijay Vittal, ISU
Finance Chair - John Lamont, ISU
Local Arrangements Chair - Ken Kruempel, ISU
Publications Chair - Mustafa Khammash, ISU
Publicity Chair - Steve Russel, ISU
Tutorials Chair - John Doherty, ISU
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CALL FOR PAPERS
The Third International Conference on
MASSIVELY PARALLEL PROCESSING USING
OPTICAL INTERCONNECTIONS (MPPOI'96)
The Westin Maui Hotel
Maui, Hawaii
October 27-29, 1996
---------------------------------------------------
Sponsored by:
* IEEE Computer Society TCCA
In Cooperation with
* ACM Special Interest Group on Architecture (SIGARCH)
* The IEEE Lasers and Electro-optics Society (LEOS)
* The Optical Society of America (OSA)
* The International Society for Optical Engineering (SPIE)
---------------------------------------------------
The third annual conference on Massively Parallel Processing
Architectures using Optical Interconnections (MPPOI'96) will be held on
Oct. 27-29, 1996 in the Westin Maui Hotel, Maui, Hawaii. The Conference
will focus on the potential for using optical interconnections in
massively parallel processing systems, and their effect on system and
algorithm design. Optics offer many benefits for interconnecting large
numbers of processing elements, but may require us to rethink how we
build parallel computer systems and communication networks, and how we
write applications. Fully exploring the capabilities of optical
interconnection networks requires an interdisciplinary effort. It is
critical that researchers in all areas of the field are aware of each
other's work and results. The intent of MPPOI is to assemble the leading
researchers and to build towards a synergetic approach to MPP
architectures, optical interconnections, operating systems, and software
development. The conference will feature invited speakers, followed by
several sessions of submitted papers, and will conclude with a panel
discussion.
The topics of interest include but are not limited to the following:
- Optical interconnections, Reconfigurable Architectures,
- Embedding and mapping of applications and algorithms,
- Packaging and layout of optical interconnections,
- Electro-optical, and opto-electronic components,
- Relative merits of optical technologies (free-space, fibers, wave
guides),
- Passive optical elements, Algorithms and applications exploiting,
- Data distribution and partitioning,
- Characterizing parallel applications,
- Cost/performance studies.
Authors are invited to submit manuscripts which demonstrate original
unpublished research in areas of computer architecture and optical
interconnections. Papers submitted must not be under considerations
for another conference.
SUBMITTING PAPERS
Authors are invited to submit manuscripts which demonstrate original
unpublished research in the above areas. Papers submitted must not be
under considerations for another conference. Send eight (8) copies of
the complete paper (not to exceed 15 single spaced, single sided
pages) to:
Dr. Eugen Schenfeld, MPPOI'96 Conference, NEC Research Institute,
4 Independence Way, Princeton, NJ 08540, USA, (voice) (609)951-2742,
(fax) (609)951-2482, email: MPPOI@RESEARCH.NJ.NEC.COM.
Manuscripts must be received by May 1, 1996
Notification of review decisions will be mailed by July 15, 1996.
Camera ready papers are due August 30, 1996.
Fax or electronic submissions WILL NOT BE CONSIDERED. The proceedings
will be published by the IEEE CS Press and will be available at
the conference.
CONFERENCE CHAIR
Rami Melhem, University of Pittsburgh
PROGRAM CO-CHAIRS
Allan Gottlieb, NYU; Yao Li, NEC Research Institute
PUBLICITY and PUBLICATION CHAIR
Eugen Schenfeld, NEC Research Institute
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ANNOUNCEMENT
Workshop on Interconnections within High Speed Digital Systems
May 19-22, 1996
Hilton of Sante Fe, Sante Fe, New Mexico, USA
---------------------------------------------------
Sponsored by:
* IEEE Lasers and Elector-Optics Society
In Cooperation with
* IEEE Computer Society
* IEEE Communications Society
---------------------------------------------------
INFORMATION:
The continuing rapid increase in the performance of high speed
electronics and communications technology has led to dramatic
improvements in advanced computing and communications systems.
The rapid growth of computer internetworking and the rise of new
applications such as multimedia and virtual reality are driving
the requirements for still higher levels of computing and
communications performance. Interconnections within digital
computing and switching systems today are often a performance
bottleneck. The purpose of this Workshop is to determine th
interconnection requirements of emerging and future computer and
communications systems, to disseminate information about optical
and electrical interconnection technology at the component,
packaging, and sub-system level as well as issues related to the
implementation of these and their system level impacts.
Because of the multi-disciplinary nature of these problems, this
Workshop brings together researchers and engineers with expertise
in a variety of fields including electronic, optoelectornic, and
optical interconnection technologies, advanced systems architectures
as well as the systems level perspective of algorithms and
applications. The Workshop is highly interactive -- in addition to
the tutorials and invited talks, all attendees participate in smaller
working groups to discuss and address the central focus Workshop
problems.
Workshop Chair: Richard Carson, Sandia National Laboratory
Program Co-Chairs:
Marry Hibbs-Brenner: Honeywell
Ashok Krisnamoorthy: AT&T Bell Laboratories
Howard Davidson: Sun Microsystems
To receive information about contributing topics/papers for presentation,
contact:
Richard Carson
Sandia National Laboratories
Dept. 1342
Albuquerque, NM 87185-5800 USA
Phone: (505)844-5015 Fax: (505)844-8985
E-mail: rfcarso@sandia.gov
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ANNOUNCEMENT
Second International Conference
Adhesives in Electronics
June 3-5, 1996
Stockholm, Sweden
---------------------------------------------------
Supported by:
* IEEE CPMT Society
* IPC
---------------------------------------------------
INFORMATION:
Polymeric electronic packaging using adhesives in electronics
manufacturing will be a key technology in future electronics.
We therefore think it is important that research people, users,
and suppliers meet to share knowledge and experience. The
conference will be in English.
Technical Topics:
* Physical properties -- optical, electrical, thermal.
* Design, simulation, modeling.
* Reliability, life expectancy, harsh testing, heat management.
* Processing and application techniques.
* Packaging and interconnection technology: Flip chip,
optical interconnection, DCA, surface mounting, BGA,
TAB, COB, power connections.
* Environmental issues.
* Novel technologies.
* Economic considerations.
Information:
Tel: +46 8 782 09 59
Fax: +46 8 782 09 00
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ANNOUNCEMENT
Workshop on VLSI and Microsystem Packaging
Techniques and Manufacturing Techologies
May 6-7, 1996
Hotel Dino, Baveno, Italy
---------------------------------------------------
Supported by:
* IEEE CPMT Society
* National Institute of Standards and Technology
In Cooperation with
* ESPRIT DGIII-Industry
* NETPACK
* Jessi
---------------------------------------------------
INFORMATION:
This is a continuation of the successful series of IEEE-CPMT
workshops on electronic packaging in Europe to further
stimulate the activities in this important and rapidly
growing area. All attendees are expected to be specialists in the
field and to participate in the discussions.
The main topics of the Workshop will be the design and
implementation of first level electronic packaging and
the technologies, materials, and equipment for the manufacture
of multichip modules and single chip packages for VLSI and
for the emerging domain of microsensors and microsystems.
Topics Include:
* Single chip package design and characterization
* Ball grid arrays (BGA)
* Chip size packages (CSP)
* Assembly, die attach, wire bonding, TAB, flip-chip, COB
* New materials, solders and adhesives, polymers, ACF
* 3D packaging, optical interconnections
* Portable applications, telephone and hand held systems
* Microsystems, automotive, and medical applications
* Packaging integration of microsensors
* Low cost packaging solutions, SPC, manufacturing
* Test and inspection, KGD, thermal management, reliability
General Chair: Carlo Cognetti: SGS-Thomson, Italy
Program Chair: Gerard Nicolas: Leit-Cea, France
Technical Committee
Eckardt Bihler: IBM, Germany
Nick Chandler: GEC-Marconi, UK
Les Fox: DEC, USA
Kare Gustafsson: Ericsson Telecom, Sweden
George Harman: NIST, USA
Hans Hentzell: Univ. Linkoping, Sweden
Karel Kurzweil: Bull, France
Kanji Otsuka: Meisei univ., Japan
Herbert Reichl: Technische Univ. Berlin, Germany
Jean Roggen: IMEC, Belgium
Michel Salagoity: Solectron, France
Hiroshi Shibata: Mitsubishi, Japan
Toshio Sudo: Toshiba, Japan
For Registration Information, contact
BAVENO 1996 VLSI Packaging Workshop Secretariat
c/o Corporate Package Development
SGS-Thomson Microelectronics
Via Olivetti, 2 - 20041 Agrate Brianza
Italy
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ANNOUNCEMENT
5th Int'l Conference and Exhibition on
Multichip Modules: MCM '96
April 17-19, 1996
Marriott Tech Center, Denver, CO USA
---------------------------------------------------
Supported by:
* ISHM
* IEPS
* EIA
* IEEE CPMT
---------------------------------------------------
Professional Development Courses
T1: Multichip Modules: The Fundamentals
R.W. Johnson, Auburn University
T2: Micro/Chip Scale Packaging: Alternatives and Challenges
Charles E. Bauer: TechLead Corp.
T3: PCMCIA: Successful Design and Manufacture
Happy Holden: HP Company
T4: Low Cost MCM-L Technology Design and Manufacture
Richard Landis: The Landis Company
Technical Program Sessions
April 17, 1996
WA1: MCM-L
WA2: MCM-C
WP1: Progress in MCM-D
WP2: High Performance Applications
April 18, 1996
THA1: Automotive
THA2: Military and Aerospace
THA3: Design and Test
THP1: Portable
THP2: Processes
THP3: Known Good Die
April 19, 1996
FA1: Modeling and Analysis
FA2: Interconnect
FA3: MCM Materials
INFORMATION: Contact
ISHM
1850 Centennial Park Drive, Suite 105
Reston, VA 22091, USA
Tel: (703)758-1060
Fax: (703)758-1066
E-mail: ISHM@aol.com
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SHORT COURSES
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SHORT CONFERENCE/MEETING NOTICES
- March 3-7, 1996:
- IPC Printed Circuits Expo '96.
Place: San Jose, CA USA
Contact: PACS Inc. (412)457-6576
- March 18-22, 1996:
- PCB Design Conference.
Place: Santa Clara, CA USA
Contact: PCB Design Conference Tel: (214)323-0575 Fax: (214)245-8700
- April 17-19, 1996:
- 5th Int'l Conf & Exhibition on Multichip Modules.
Place: Denver, CO USA
Contact: ISHM (703)758-1060
- May 19-22, 1996:
- Workshop on Interconnections within High Speed Digital Systems
(HSD'96).
Place: Sante Fe, NM USA
Contact: IEEE LEOS
- May 28-31, 1996:
- 46th Electronic Components and Technology Conf.
Place: Orlando, FL USA
Contact: Electronic Industries Association (703)907-7500
- June 16-21, 1996:
- IEEE int'l Microwave Symposium & Exhibition.
Place: San Francisco, CA USA
Contact: Kelly Fleming (617)769-9750
- Oct. 27-29, 1996:
- 3rd Int'l Conf. on Massively Parallel Processing using Optical
Interconnections (MPPOI'96}.
Place: Maui, Hawaii, USA
Contact: IEEE LEOS
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Recent Books
None this issue.
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IEEE CPMT INFORMATION
Submitted by Paul Wesling:
The Table of Contents for upcoming/current issues of the IEEE Trans.
on Advanced Packaging can be browsed, to see what topics and papers
are being included. For example, the May issue of this quarterly
journal has a special section of six papers on the topic of
optoelectronics packaging, edited by R. Boudreau, and a second section
of 6 papers on Adhesive Joining Technology in Electronics Manufacturing,
edited by J. Morris. There are other sections on flip-chip packaging,
multichip modules, electrical performance modeling, and other topics in
this issue.
To browse the Table of Contents, access the WEB server at
http://www.ieee.org/pub_preview/cpmtb_toc.html
Each quarter, this location will be updated with the next Table of Contents.
For information on subscribing to this quarterly journal (800 pages/year;
about 100 papers), call IEEE (in the USA tollfree at 1-800-678-IEEE) and
ask for publication 021-1651. Subscriptions are $250/year (non-IEEE
members). You may wish to join IEEE (members get substantial discounts);
if so, request information from IEEE or contact p.wesling@ieee.org for
information.
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