CPMT INFORMATION
CONFERENCES AND WORKSHOPS
CALL FOR PAPERS
13th Annual IEEE Semiconductor Thermal Measurement and Management
(SEMI-THERM)
January 28-30, 1997
Four Seasons Hotel
Austin, Texas USA
---------------------------------------------------
Sponsored by:
* IEEE Components Packaging and Manufacturing Technology Society
* National Institute for Standards and Technology
---------------------------------------------------
INFORMATION
Semi-Therm is an international forum dedicated to new developments
in the thermal characterization of electronic components and
systems. The symposium is desighed to foster the exchange of
information from both academic and industrial communities on
advances in the thermal management of electronic systems. Semi-Therm
is well-known for its workshop atmosphere with single-session programs
coupled with technical workshops, tutorials, vendor exhibits, and
optional short courses. Student papers are being solicited this
year: for details, contact the program chair.
TOPICS OF INTEREST
Areas of interest include the following
* Thermal characterization -- component through system
* Analytical and computational modeling and simulation.
* Experimental methods and applications.
* Thermal design and modeling.
Special interest will also be placed on papers emphasizing the
following topics.
* Heat-sink modeling and characterization.
* Automotive and high-power electronics applications.
* Cooling techniques for notebook computers and portable
equipment
* Thermal management innovations for MCMs.
* Thermal control and management using phase change materials.
SUBMISSION INSTRUCTIONS
Selection of papers for presentation is solely based on the
extended abstract. Authors should submit a complete summary
of the proposed paper that consists of work or results not
previously presented or published. The abstract should contain
key results supporting the conclusions and findings in at least
two pages of single-spaced text with additional pages of
figures, tables, and references as apporpriate. The purpose of
the extended abstract is to demonstrate that the proposed paper
is appropriate for SEMI-THERM and is high technical quality and
significance.
Submission of an abstract represents a commitment to submit a
cleared manuscript for publication in the Symposium Proceedings
and to attend and present the paper at SEMI-THERM in January, 1997.
Send abstracts to the program chair
Seri Lee, Program Chair
Aavid Thermal Technologies
One Kool Path
Laconia, NH 03247 USA
Tel: (603)527-2339
Fax: (603)528-1478
Email: lee@aavid.com
IMPORTANT DATES
Abstract deadline: July 15, 1996
Notification of abstract acceptance: September 15, 1996
Photo-ready full manuscript due: November 1, 1996
FINAL MANUSCRIPT
Final manuscripts are expected to be approximately eight pages
including figures. The language of the symposium is English.
PEOPLE
Program chair: Seri Lee, Aavid Thermal Technologies, Laconia, NH USA
General chair: Thomas S. Tarter, Advanced Micro Devices,
Sunnyvale, CA USA
European Liaisons
* Harvey Rosten; Flometrics Lmt.; 81 Bridge Rd.; Hampton Court;
Surrey KT8 9HH UK
Tel: 44-181-941-8810 Fax: 44-181-941-8730
Email: harvey@flopc.demon.co.uk
* Clemens J.M. Lasance; Philips Research; Prof. Holstlaan 4 (WB31)
5656AA Eindhoven; The Netherlands
Tel: 31-40-27-42795 Fax: 31-40-27-44288
Email: lasance@natlab.research.philips.com
Symposium/Exhibitor Information
* Bonnie Crystall or Walter Schuch; C/S Communications, Inc.
Tel: 602-345-1118 Fax: 602-345-1119
Email: cscom@indirect.com
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CALL FOR PAPERS
IEEE Laser and Electro-Optics Society 1996 Annual Meeting
November 18-21, 1996
The Westin Hotel Boston
Boston, MA USA
---------------------------------------------------
Sponsored by:
* IEEE Laser and Electro-Optics Society
---------------------------------------------------
INFORMATION
LEOS'96 is the ninth annual meeting of the IEEE LEOS Society. This
conference has established itself as an important forum for keeping
abreast of the latest developments in lasers and electro-optics
technologies. With a strong core of invited talks by preeminent
speakers from around the globe, LEOS'96 also provides and ideal
platform to learn about new fields and understand technological
trends. The conference incorporates invited papers, topical
symposia, and contributed technical papers addressing a broad
spectrum of topics of interest to LEOS members and the lasers
and electro-optics community.
TOPICS OF INTEREST
* Electro-optical sensors and systems.
* Integrated optics and optoelectronics
* Lasers in medicine and biology
* Nonlinear optics
* Optical communications
* Optical fiber and planar waveguide networks and systems.
* Optical interconnects and processing systems.
* Optical materials and processing
* Optoelectronic packaging, manufacturing and reliability
* Semiconductor lasers
* Short wavelength and gas lasers.
* Solid-state lasers
* Ultra-fast optics and electronics.
SUBMISSION OF PAPERS (Deadline - June 7, 1996)
Originalpapers that have not been previously presented and which
describe new contributions to the areas covered in the topics of
interest are solicited for LEOS'96
Papers will be selected by theLEOS'96 Program Committee based upon
technical content described in the submitted abstract and
summary. Each author is required to complete and submit the
following.
* Attached Categorization Form: To obtain call for papers
with the categorization form, contact
Leos'96 Program
IEEE/LEOS
445 Hoes Lane
P.O. Box 1331
Piscataway, NJ 08855-1331
Tel: (908)562-3897
Fax: (908)562-8434
* 35 word abstract (to be printed in the LEOS'96 Advance Program)
* 2-page camera-ready summary -- please submit an ORIGINAL
to be printed in the LEOS'96 Proceedings and one(1) copy.
* IEEE/LEOS Copyright form (provided at time of paper acceptance).
Submit the above material to the "LEOS'96 Program" address above
NO LATER THAN JUNE 7, 1996.
General Chair Program Chair
Jon Heritage Peter Zory
University of California University of Florida
Davis, CA Gainesville, FL
Return to Index
Return to Conference Listing
ANNOUNCEMENT
Surface Mount Interntional
Advanced Electronics Manufacturing Technologies
September 8-12, 1996
San Jose Convention Center
San Jose, CA USA
---------------------------------------------------
Sponsored by:
* Electronic Industries Association
* Institute for Interconnecting and Packaging Electronic Circuits
* Surface Mount Technology Association
---------------------------------------------------
INFORMATION
SMI will explore the latest advances in
* Array technology: ball grid array, chip scale packaging
* Contract management
* SMT manufacturing/production/process/test
* Direct chip attach/flipchip technology
* Chip on board/chip on flex
* Underfill materials
* Emerging technologies
* Alternatives to solder
* Optical interconnects
* 3D packaging
* and more.
The technical program features over 90 original papers and
30 tutorials/workshops.
A exhibition floor with over 680 boots with products and equipment
encompassing the entire industry/
WEB SITE:
For additional information contact
Surface Mount International
c/o ARI
1420 Mac Arthur Drive, #104
Carrollton, TX 75007
Tel: (415) 905-4994
Fax: (3214) 466-4611
Email: smi@mfi.com
Return to Index
Return to Conference Listing
CALL FOR PAPERS
CHIP SCALE/FLIP CHIP PACKAGING WORKSHOP
Sept. 9-11, 1996
Binghamton, NY
---------------------------------------------------
Sponsored by:
* IEEE CPMT Society
---------------------------------------------------
Submitted by R. Gedney
INFORMATION:
The IEEE CPMT Society and the Binghamton CPMT Chapter are jointly
sponsoring a workshop on Chip Scale and Flip Chip Packaging. All
attendees are expected to be specialists in electronic packaging and
participate in discussions. The Workshop will be held immediately before
the Ninth Annual Soldering Technology For Electronics Packaging
Symposium sponsored by Binghamton University in the same hotel. The
Soldering Symposium will address solder materials for area array and
fine pitch packages. The Workshop will be conducted in single, sequential
sessions so that attendees will be able to hear every papers. Most
papers will be 20 minutes long with time for questions and discussions.
The Workshop wishes to highlight the practical and seeks papers
providing actual manufacturing experience. The Workshop goal is to
provide attendees with papers and discussions of actual experiences with
these technologies.
Chip Scale Packages
- Design rules, particularly for PCB Assembly
- Thermal management, modeling/designs
- Production experience including assembly test and repair
- Various applications: auto, computer, communications
- Analytical techniques to ensure robust processes
- PCB joining processes, inspection, process control
- Applications experience (MCM, PCMCIA, etc.)
- Reliability issues including
- Environmental testing
- Board level assembly
- Socketing, test, burn-in
Flip Chip Interconnection
- Design for reliability
- Flip Chip device manufacturing
- Under bump metallurgies
- Bump metallurgies
- Processes, costs, tradeoffs
- Substrate design for flip chip interconnections
- Joining processes (both PCB and Ceramic)
- Underfill. encapsulants and interconnection reliability
- Test and burn-in, rework and repair techniques
- Inspection/process control techniques
- Flip Chip standards: geometries, configurations, metallurgies
PAPER SUBMISSION:
A 300 word abstract should be sent to either:
Ron Gedney, General Chair Don Seraphim, Program Chair
2636 Lynnhurst Drive or 400 Rano Blvd.
Vestal, NY, 13850 Vestal, NY 13850
Phone/fax: 607-770-8886 Phone/fax: 607-798-9474
Abstracts must be received by May 15, 1996. The abstract,
supplemented with up to four of your most important figures (optional),
will be given to all attendees. Authors will be notified of paper
acceptance by June 30, 1996.
EXHIBITS:
The conference will be seeking corporate sponsors and technical
exhibits relating to the theme of the Workshop. Exhibits will available,
and special time made for attendees to view them, during the second day
of the Workshop. For information, contact Ron Gedney, General Chair.
Return to Index
Return to Conference Listing
Call For Papers
SPECIAL SESSION ON OPTOELECTRONIC COMPUTING SYSTEMS
The Third International Conference On
ELECTRONICS, CIRCUITS AND SYSTEMS
October 13-16, 1996
Rodos, GREECE
---------------------------------------------------
Sponsored by:
* IEEE Circuits and Systems Society
---------------------------------------------------
Submitted by Pericles A. Mitkas
DEADLINE: Delays in getting newsletter out leaves little time
for meeting deadline. Apologies!
Deadline: May 13, 1996 (paper); May 19, 1996 (electronic)
INFORMATION
The 1996 International Conference on Electronics, Circuits and
Systems (ICECS '96) is the third in a series of annual conferences
organized in the Mediterranean area. It is the annual region-8 IEEE
Conference of the Circuits and Systems Society.
It will be held on the island of Rodos, Greece, October 13-16,
1996. Plenary sessions, special sessions, invited talks, and
tutorials on specific advanced topics will also be included in the program.
SPECIAL SESSION ON OPTOELECTRONIC COMPUTING SYSTEMS(OCS Session)
Recent advances in optoelectronics have yielded new and
promising materials and devices which, in turn, have rejuvenated the
interest in optical computing systems. The commercial success of
optical disks and the development of global fiber optic interconnection
networks naturally led to the investigation of optical digital processing
techniques. Optics brings high speed, massive parallelism, and has lower
power requirements.
In this session, we will discuss the latest developments in
enabling technologies, novel techniques, and system demonstrations
for optical computing in an effort to identify applications that can
benefit from optoelectronic data processing. We are also interested in
outlining the technological barriers that must be overcome to make
optical computing a mainstream approach.
Topics of interest include:
- Optoelectronic logic devices
- Optical memories
- Optical interconnection networks
- Optoelectronic analog/digital processing systems
Chair: Pericles A. Mitkas
Optoelectronic Computing Systems Center
and Department of Electrical Engineering
Colorado State University
Fort Collins, CO 80523-1373 Tel. +1-970-491-7481
U.S.A. Fax +1-970-491-2249
Email: mitkas@lance.colostate.edu
SUBMISSION
Authors are invited to submit 4 copies of an extended summary, not
less than 5 pages, or the full paper, not more than 12 double-spaced
pages. The title page should include author(s) name(s), affiliation,
mailing address, telephone, FAX, email, plus a 100-word abstract. The
special session title must also be clearly indicated on the cover page.
The official language of the conference is English
Papers must be received by May 13, 1996 at the address below:
ICECS Secretariat,
EE Department,
University of Patras, Tel: +30 61 997 283
26500, Greece. Fax: +30 61 994 798
Electronic submissions are strongly encouraged
----------------------------------------------
They should consist of two e-mails:
* The first one containing an ASCII cover page, giving the author(s)'s
full name(s), address, telephone number, fax number, e-mail address,
a 100-word abstract, and the session title.
* The second one with the printable file, most preferably in attachment.
The only acceptable format is a uuencoded compressed PostScript file.
If possible, please attempt to print the document on more than one
brand/model of laser printers. If your program requests it, assume that
the document will be printed on a 300 DPI standard PostScript HP laser
printer. We will do our best to get all files printed. If a file cannot
be printed though, we will have to reject the electronic submission.
Please, indicate in your first (cover) email message the sizes in bytes
of the original postscript, compressed, and uuencoded files. Acceptable
compressed formats are: .Z (unix compress) or .gz (gzip, version 1.2.4).
The files should be mailed to icecs96@lance.colostate.edu and received
at this address before May 19, 1996.
IMPORTANT DEADLINES:
Submission of papers:
(Hard copy must be received by) May 13, 1996
(Postscript file must be received by) May 19, 1996
Notification of acceptance: June 30, 1996
Camera ready papers: August 1, 1996
SOCIAL PROGRAM
In addition to the technical program, a great social program will be
planned for the participants and their companions: Excursions to the
ancient acropolis of Lindos, visits to the magnificent Castle of the
Knights, which surrounds the city of Rodos, and local music nights.
It will be a great opportunity to meet friends, while enjoying the
beautiful October weather of the Aegean.
For updated information regarding ICECS'96, please consult the www site:
http://www.vlsi.ee.upatras.gr/ICECS96/
Return to Index
Return to Conference Listing
ANNOUNCEMENT
The Third International Conference On
MASSIVELY PARALLEL PROCESSING USING
OPTICAL INTERCONNECTIONS (MPPOI'96)
October 27-29, 1996
The Westin Maui Hotel
Maui, Hawaii
---------------------------------------------------
Sponsored by:
* IEEE CS TCCA (Technical Committee on Computer Architecture)
In Cooperation with
* ACM Special Interest Group on Architecture (SIGARCH)
* The IEEE Lasers and Electro-optics Society (LEOS)
* The Optical Society of America (OSA)
* The International Society for Optical Engineering (SPIE)
---------------------------------------------------
Submitted by Eugen Schenfeld
INFORMATION
The third annual conference on Massively Parallel Processing
Architectures using Optical Interconnections (MPPOI'96) will be held on
Oct. 27-29, 1996 in the Westin Maui Hotel, Maui, Hawaii. The Conference
will focus on the potential for using optical interconnections in
massively parallel processing systems, and their effect on system and
algorithm design. Optics offer many benefits for interconnecting large
numbers of processing elements, but may require us to rethink how we
build parallel computer systems and communication networks, and how we
write applications. Fully exploring the capabilities of optical
interconnection networks requires an interdisciplinary effort. It is
critical that researchers in all areas of the field are aware of each
other's work and results. The intent of MPPOI is to assemble the leading
researchers and to build towards a synergetic approach to MPP
architectures, optical interconnections, operating systems, and software
development. The conference will feature invited speakers, followed by
several sessions of submitted papers, and will conclude with a panel
discussion.
TOPICS OF INTEREST INCLUDE BUT ARE NOT LIMITED TO THE FOLLOWING
- Optical interconnections, Reconfigurable Architectures,
- Embedding and mapping of applications and algorithms,
- Packaging and layout of optical interconnections,
- Electro-optical, and opto-electronic components,
- Relative merits of optical technologies (free-space, fibers, wave
guides),
- Passive optical elements, Algorithms and applications exploiting,
- Data distribution and partitioning,
- Characterizing parallel applications,
- Cost/performance studies.
Authors are invited to submit manuscripts which demonstrate original
unpublished research in areas of computer architecture and optical
interconnections. Papers submitted must not be under considerations for
another conference.
SUBMITTING PAPERS
Authors are invited to submit manuscripts which demonstrate original
unpublished research in the above areas. Papers submitted must not be
under considerations for another conference. Send eight (8) copies of the
complete paper (not to exceed 15 single spaced, single sided pages) to:
Dr. Eugen Schenfeld, MPPOI'96 Conference, NEC Research Institute,
4 Independence Way, Princeton, NJ 08540, USA, (voice) (609)951-2742,
(fax) (609)951-2482, email: MPPOI@RESEARCH.NJ.NEC.COM.
DEADLINES:
Receipt of manuscripts are due MAY 1, 1996
Notification of review decisions will be mailed by July 15, 1996.
Camera ready papers are due August 30, 1996.
Fax or electronic submissions WILL NOT BE CONSIDERED. The proceedings
will be published by the IEEE CS Press and will be available at the
conference.
CONFERENCE CHAIR
Rami Melhem, University of Pittsburgh
PROGRAM CO-CHAIRS
Allan Gottlieb, NYU; Yao Li, NEC Research Institute
PUBLICITY and PUBLICATION CHAIR
Eugen Schenfeld, NEC Research Institute
Return to Index
Return to Conference Listing
SENSING, MODELING AND SIMULATION IN EMERGING
ELECTRONIC PACKAGING SYMPOSIUM
in the
1996 ASME International Mechanical Engineering
Conference And Exhibition
November 17-22, 1996
Atlanta, Georgia, U.S.A.
---------------------------------------------------
Sponsored by:
* Electrical and Electronic Packaging Division (EEPD), ASME
---------------------------------------------------
Submitted by Koneru Ramakrishna
INFORMATION
Original papers in Sensing, Modeling and Simulation in Emerging
Electronic Packaging applicable to the following technologies are
invited:
* Interconnects (Flip Chip, Chip on Board, C5, Conductive Polymers,
Solder Alloys, High Density Substrates, BGA, TAB, etc.)
* Sensor Technologies & MEMS
* Impact/Drop Simulation
* Material Characterization and Reliability Prediction
* Thermal Management and Computational Fluid Dynamics
* Experimental Methods for Simultaion/Modeling Validation
Perspective authors are encouraged to submit three copies of a
300-word abstract by March 31, 1996 to:
Chao-pin Yeh, Ph.D.
Motorola, Inc.
1303 E. Algonquin Road,
MD: IL01/ANX2
Schaumburg, IL 60196
Tel: (847) 576-4542, Fax (847) 538-5178
Email: ACY001@email.mot.com
Important dates:
3/31 - abstract due
4/30 - notification of acceptance
7/15 - final paper on mats due
Return to Index
Return to Conference Listing
SHORT CONFERENCE/MEETING NOTICES
June 10-13, 1996: NEPCON East '96.
Boston, MA USA. (203) 840 5443
August 12-14, 1996: 1996 Int'l Symp. on Low-Power Electronics and Design
Monterey, CA. (408)296-6883 (sigda@nextwave.com)
Sept. 8-12, 1996: Surface Mount International '96
San Jose, CA USA. (214) 239-3060
Sept. 16-18, 1996: Annual Connector Symp. and Trade Show.
Boston, MA USA. (908) 233-7278
Sept. 17-18, 1996: Canadian High Technology Show.
Toronto, Ontario, CANADA. (203) 840-5443
Sept. 18-19, 1996: Int'l Flotherm User Conference.
Paris, FRANCE. 44 (0) 181 941 8810
Sept. 24-26, 1996: Assembly Technology Expo
Rosemont, Illinois, USA. (847) 260-9700
Sept. 29 - Oct 2, 1996: 1996 Annual IEPS Conf.
Austin, TX USA. (612)922-1988
Oct. 8-10: ISHM Symposium.
Minneapolis, MN USA. (703) 471-0066
Oct. 8-11, 1996: Elenex Australia '96
Melbourne, AUSTRALIA. (In USA, 301 656 2942)
Oct. 9-12, 1996: Globaltronics
SINGAPORE. (In USA, 203-840-5443
Oct. 22-24, 1996: Wescon '96
Anaheim, CA USA. (310)215-3976
Nov. 4-6, 1996: Northcon '96
Seattle, WA USA. (310)215-3976
Nov. 18-22, 1996: Comdex Fall Show
Las Vegas, NV USA (617)449-6600
Return to Index
To submit web sites (including yours) for
addition to the list, feel free to email them to pkg_news@msrc.wvu.edu.
In this case, you can provide a summary of the activities of the
company/group represented by the web site.
- 3M Corp
- Amp Corp
- AP Labs
- Aavid Thermal Technologies, Inc.
Heat sinks technologies
- Aries Electronics Adaptor
packages for mounting, test sockets, dip switches, etc.
- Artwork Conversion Software, Inc.
Conversion software to translate to Gerber files.
- AVX Corp.
Low inductance capacitors (including use with BGA and flip-chip).
- Berg Electronics.
Cables, other electronics hardware
- Bivar, Inc.
Electronic assembly hardware
- CadSoft Computer Inc.
Eagle PCB Design tools
- Circuit Components, Inc.
Components for control of EMI, noise, RF. Bus bars. Under IC capacitors
- CMP Enclosures.
Electronic equipment enclosures
- Condor DC Power Supplies,
Inc. DC power supplies
- Coselusa, Inc.
Switching power supplies.
- Davies Molding Co.
- E-Mark, Inc.
- ebm/Papst.
Electronic cooling equipment, fans blowers.
- EDAC Inc.
- ECS Composites.
Manufacturer of reusable military/commercial containers.
- EDA roadmap.
On-line access to the EDA Standards Committee Roadmap.
- Elcon Products, Int'l.
- Elma Electronics, Inc.
Switches. Equipment cabinets.
- Envoy Data.
PCMCIA products.
- ERNI Components Inc.
Wide range of connectors.
- E-Switch Co.
Wide range of switches.
- ETA Corp.
Circuit protection components.
- G&L Precision Die Cutting, Inc.
- Hewlett-Packard Corp.
High frequency design software CAD tools.
- HT Communications.
- Hybricon Corp.
- ITT Cannon Corp.
- Instrument
Specialties. EMI/RF shielding technologies.
- Kepco Inc.
DC power supplies.
- Keystone Electronics.
Various electronics hardware.
- Kycon Cable & Connectors.
Connectors include low ferrite connectors.
- Marlow Industries.
- Memory Protection Devices.
- Methode Electronics.
Interconnection products including terminators, MCM headers, sockets, fiber
connectors.
- Molex Inc.
Cable and pcb connectors.
- MPM Corporation.
Production stencil printing equipment.
- Olflex Wire and Cable Co.
Cables for data transmission, general wire and cable.
- Opamp Labs Inc.
- OrCad.
CAD tools for PCB design.
- PACE Inc.
PCB rework and repair stations, soldering tools.
- Panduit Corp.
Cable materials.
- Phoenix Contact Inc.
High density PCB terminal blocks and connectors. Test equipment. Surge
protectors.
- Power-One Power Supplies.
Wide range of power supplies.
- Priema Plastics Inc.
- Pulizzi Engineering, Inc.
Power sequencing equiment.
- RAF Electronic Hardware.
Electronics hardware.
- Rittal Corp.
- Rogers Corp.
- Samtec Inc.
Connectors (micro pitch, surface mount, board to board, high density, etc.).
- Schroff Inc.
electronics enclosures, cabinets. VME backplanes.
- Switchcraft Inc.
Connectors, switches, etc.
- TDJ Co.
Over-voltage protection.
- Technit.
Laser printable materials for PCB fabrication, EMI shielding materials.
- Teka Interconnection Systems.
- Teredyne Connection Systems.
- Trompeter
Electronics.
- Tusonix Corp.
EMI filters, ceramic filters, terminal blocks, etc.
- Vector Electronic Co.
- VeriBest Inc.
- Vero Electronics.
Backplanes (VME,VXI), card cages/enclosures, power supplies, etc.
- Vicor Corporation.
Wide range of power sources.
- Vynckier Enclosures Systems.
- Wakefield Engineering.
- Wieland Inc.
Modular connectors for high density PCB wiring, Surge protectors.
- Yamaichi Electronics USA Inc.
Test contactors, burn-in sockets, emulation and prototyping sockets,
production sockets. known good die & chip scale packaging.
- Zero Enclosures.
Enclosures, boxes, racks for electronics.
Return to Index
Author: Clyde F. Coombs, Jr.
Topics (description from advertisement)
- Designing and engineering for performance and manufacturability
- Developing an effective computer-aided design process
- Selecting computer tools for PCB design and simulation
- Understanding and using SMT and MCM technologies
- and much more.
The Printed Circuits Handbook contains 900 pages, with 800
illustrations. Order #012754-9. Price: $89.50.
Publisher: TAB Electronics/McGraw-Hill ,PO Box 182606, Columbus, OH
43272-3033.
Tel: 1-800-822-8158
Fax: 1-614-759-3644
Author: Thomas H. Stearns.
Description (from advertisement)
The importance of flexible circuitry is increasing as the need to
conserve space has become more critical in today's electronics
circuitry applications. Unlike other books which devote only
a single chapter to the topic or books that are compilations from
many sources, Flexible Printed Circuitry is the first single-author
book to cover this hot topic. You'll learn the relationships
between design variations and overall cost and get the
informtion necessary to successfully design and implement the
manufacture of flexible printed circuitry.
Flexible Printed Circuitry contains 352 pages, with 100
illustrations. Order #061032-0. Price: $60.00.
Publisher: TAB Electronics/McGraw-Hill ,PO Box 182606, Columbus, OH
43272-3033.
Tel: 1-800-822-8158
Fax: 1-614-759-3644
Author: Jane Axelson.
Description (from advertisement)
Learn the latest PC-board fabrication techniques with this
learn-by-example guide. The book includes 25 projects and
experiments that teach you how to:
- draw circuit diagrams
- transfer artwork to pc blanks
- etch copper patterns and drill lead holes
- solder companents, repair and modify boards
Master all the latest techniques for low-cost, speedy
construction and discover applications for surface-mount
components, computer-aided design, safety, and environmental
production.
Making Printed Circuit Boards contains 304 pages, with 150
illustrations. Order #002799-4. Price: $19.95.
Publisher: TAB Electronics/McGraw-Hill ,PO Box 182606, Columbus, OH
43272-3033.
Tel: 1-800-822-8158
Fax: 1-614-759-3644
Author: Vern Solberg.
Description (from advertisement)
Advances in surface mount technology in the past few years have
had a significant impact on the way in which electronic products
are manufactured. This second edition brings you right to the
forefront of this rapidly evolving field.
Still the only book to focus on design for manufacturing of surface
mount PC boards, the new edition features the latest breakthroughs
in fine pitch and ball-grid array devices. You'll get step-by-step
guidance from one of the industry's best-known experts for
developing the most cost-effective products possible using SMT.
Design Guidelines for Surface Mount and Fine
Pitch Technology contains 288 pages, with 100
illustrations. Order #059577. Price: $52.00.
Publisher: TAB Electronics/McGraw-Hill ,PO Box 182606, Columbus, OH
43272-3033.
Tel: 1-800-822-8158
Fax: 1-614-759-3644
Author: Michael Pecht and Yeun Tsun Wong (editors).
Description (from advertisement)
This book presents the technologies, algorithms, and methodologies
for engineers and others developing the next generation of electronic
products. Contents:
- The general solution of the rectilinear Steiner's problem and its
applications.
- Refinement approaches for rectilinear Steiner Tree construction
- Rectilinear interconnections in the presence of obstacles.
- Performance driven global routing and wiring rule generation for high
speed PCBs and MCMs.
- Routing for analog and mixed circuit.
- Segmented channel routing
- Restricted routing for CMOS gate arrays.
- Recent developments in wiring and via minimization
- Layout compactions for high-performance/large-scale circuits.
- Ripup dn reroute strategies.
- Parallel routing
- Appendix A: Symbols
- Appendix B: Acronyms
- Appendix C: Glossary
Advanced Routing of Electronic Modules contains 488 pages, ISBM
0-8493-9622-0, Price: $84.95.
Publisher: TAB Electronics/McGraw-Hill ,PO Box 182606, Columbus, OH
43272-3033.
Tel: 1-800-822-8158
Fax: 1-614-759-3644
Return to Index
Return to Books Index Item
Submitted by Paul Wesling:
Table of
Contents for upcoming/current issues of the IEEE Trans. on Advanced
Packaging. Each quarter, this location will be updated with the next Table of
Contents.
For information on subscribing to this quarterly journal (800 pages/year;
about 100 papers), call IEEE (in the USA tollfree at 1-800-678-IEEE) and
ask for publication 021-1651. Subscriptions are $250/year (non-IEEE
members). You may wish to join IEEE (members get substantial discounts);
if so, request information from IEEE or contact p.wesling@ieee.org for
information.
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