CPMT INFORMATION
CONFERENCES AND WORKSHOPS
The PACIFIC RIM/ASME International, Intersociety
Electronic & Photonic Packaging Conference
(INTERpack '97)
Hotel Orchid at Mauna Lani
Kohala Coast, Island of Hawai'i, USA
June 15-19, 1997
Submitted by: D.C.Whalley
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Sponsored by:
* The American Society of Mechanical Engineers Int'l (ASME)
Participating Societies
* The Japan Society of Mechanical Engineers (JSME)
* The Institute of Electrical & Electronics Engineers (IEEE)
* The Japan Society of Mechanical Engineers (JSME)
* International Electronic Packaging Society (IEPS)
* The Japan Society of Mechanical Engineers (JSME)
* The International Society for Hybrid Microelectronics (ISHM)
* The Japan Society of Mechanical Engineers (JSME)
* Society of Plastics Engineers (SPE)
* The Japan Society of Mechanical Engineers (JSME)
* Optical Society of America (OSA)
* The Japan Society of Mechanical Engineers (JSME)
* Materials Research Society (MRS)
* The Japan Society of Mechanical Engineers (JSME)
* Japan Welding Society (JWS)
* The Japan Society of Mechanical Engineers (JSME)
* Japan Institute for Interconnecting and Packaging Electronic Circuits
(JIIPEC)
* The Japan Society of Mechanical Engineers (JSME)
* The Institute of Electronics Information and Communication Engineers
(IEICE)
* The Japan Society of Mechanical Engineers (JSME)
* SHM-The Microelectronics Society JAPAN
* The Japan Society of Mechanical Engineers (JSME)
* The Japan Society for Composite Materials (JSCM)
* The Japan Society of Mechanical Engineers (JSME)
* Japanese Society for Strength and Fracture of Materials (JSSFM)
* The Japan Society of Mechanical Engineers (JSME)
* The Japanese Society for Non-Destructive Inspection (JSNI)
* The Japan Society of Mechanical Engineers (JSME)
* Society of Automotive Engineers of Japan, Inc. (SAEJ)
* The Japan Society of Mechanical Engineers (JSME)
* The Society of Naval Architects of Japan (SNAJ)
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INFORMATION
INTERpack '97 is ----------------------------------------------------------
"An International Exchange of State-of-the-Art Knowledge Pertaining to
Engineering Practice in Research, Development, Manufacturing, and
Application of the Science & Technology of Electronic & Photonic
Packaging"
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CONFERENCE OBJECTIVES
International cooperations, understanding and promotion of efforts and
disciplines in Microelectronics, Optoelectronics, and Photonics Packaging
Engineering in an East/West business setting. Dissemination of knowledge
pertaining to the art, science and practice in Electronic and Photonic
Packaging Engineering will serve as the foundation upon which the
conference program will be developed.
Advisory Committee: A. Bar-Cohen, T.R. Hsu, A.D. Kraus, S. Matsuoka,
W. Nakayama
General Chairs: E. Suhir (US), M. Shiratori (Japan)
Program Chairs: Y.-C. Lee (US), G. Subbarayan (US)
International Liasons: H. Abe, I. Ikegami (Japan); Y.-H. Hung, A. Lin
(Taiwan); K.W. Paik (Korea); M. Sceats (Australia); A. Tay (Singapore); A.
Tylikowski (Poland), D. Whalley (UK); E. Zakel (Germany), Johan Liu
(Sweden).
Program Committee: includes the international liasons and other leading
specialists in the field.
KEYNOTE SPEAKERS
R. Hanneman (US), J. Hwang (US), F. Ishitsuka (Japan), M. Pecht (US), R.
Tummala (US)
INVITED SPEAKERS
Partial list of invited speakers includes: H. Abe (Japan), D. Agonafer
(US), P. Ayyaswami (US), A. Bar-Cohen (US), W.T. Chen (US), H. Conrad
(US), R. Darveaux, (US), C. S. Desai (US), P. Engel (US), J. Fillo (US), D.
Frear (US), L. Goldmann(US), G. Grimes (US), C. Handwerker (US), P.
Haugsjaa (US), Y. Hiruta(Japan), W.K. Jones (US), N. Koopman (US), J. Lau
(US), C.K. Lim (US), A.Lin (Taiwan), R. Mahajan (US), S. Matsuoka (US),
L.L. Moresco (US), L.Nguyen (US), W. Nakayama (Japan), S.-Y. Oh (Korea),
Y. Pao (US), R.Pryputniewicz (US), B.G. Sammakia (US), M. Sceats
(Australia), M. Shiratori (Japan), T. Suga (Japan), E. Suhir (US), A.A. Tay
(Singapore), Y. Tsukada (Japan), E. Zakel (Germany), D.J. Williams (UK),
C.P. Wong (US).
WHO SHOULD ATTEND?
Researchers, designers, technical managers, electronic and photonic
packaging system developers and users involved in Microelectronic and
Photonic Packaging. The technical program will have strong technical
content and will include panel sessions, paper presentations and short
courses (tutorials) addressing both fundamental and applied aspects of the
"high technology" engineering as related to the field of packaging. Paper
presentations will be published in the conference proceedings. The mix of
speakers, geographical origins and technical backgrounds will be very
broad. Particular emphasis will be placed on East/West technology transfer
and mutually beneficial business opportunities/ applications contained
within a cooperative international electronic packaging industry
environment.
TUTORIALS
Inter-society sponsored tutorials will be featured as part of the INTERpack
'97 program. Each tutorial will focus on technology transfer and the
associated business opportunities present within research & development,
manufacturing & application of Electronic & Photonic Packaging.
PUBLICATIONS
As a joint, East/West Inter-society publications event, INTERpack '97 will
also feature the latest in Electronic & Photonic Packaging publications and
supporting materials on topics such as Microelectronics, Optoelectronics &
Photonics Packaging engineering.
EXHIBITION
Industrial/research exhibits featuring both Pacific Rim and Western
products/technologies will be open to all conference participants.
To be included in the conference as an exhibitor or to receive further
details regardings these and other yet-to-be announced INTERpack '97
special program features, please complete the Intent to Participate form
and return to the address listed. You and/or your organization will be
contacted.
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Second European Surface Mount Conference
"Sharing in the advancement of the electronics manufacturing industry"
12-14 November 1996
Old Ship Hotel
Brighton UK
Submitted by: Tony Gordon
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Organized by:
* The SMART Group
Further details are available by contacting:
Tony Gordon
The SMART Group
86 Easton Street
High Wycombe
Buckinghamshire HP11 1LT
UK
Tel:+44 (0) 1494 465 217
Fax:+44 (0) 1494 473 975
Email: smart@smtuk.demon.co.uk
INFORMATION:
This conference is a must for companies associated with
electronics assembly wanting to keep abreast of the latest manufacturing
developments, and requiring to improve the efficiency of their processes
and the reliability of their products.
In addition to a conference programme that includes experts from around the
world, the event has workshops and a trade table-top exhibition. There
are also a number of social times, to enable delegates to exchange views
and ideas informally.
SESSIONS
Session A: ENVIRONMENTAL DRIVERS IN ELECTRONICS MANUFACTURING
Session B: MATERIALS FOR THE FUTURE
Session C: QUALITY & RELIABILITY
Session D: STATE-OF-THE-ART MANUFACTURING
Workshop W1: DESIGN FOR MANUFACTURE
Workshop W2: TROUBLESHOOTING THE REFLOW SOLDERING PROCESS
Workshop W3: RELIABLE MANUFACTURING WITH BGAs
Workshop W4: PRACTICAL QUALITY CONTROL IN SURFACE MOUNT
Special Workshop SW1: ENTRY-LEVEL SURFACE MOUNT:
Special Workshop SW2: USING THE INTERNET TO YOUR ADVANTAGE
Special Workshop SW3: CONTRACT MANUFACTURING CHALLENGES: A discussion
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Nineteenth International
Electronics Manufacturing Technology Symposium
"Manufacturing Technologies for a Global Economy"
October 14-16, 1996
Austin, Texas USA
Submitted by: Terry Chappell
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Sponsored by:
* Components, Packaging, and Manufacturing Technology Society of the IEEE
* Semiconductor Equipment and Materials Int'l (SEMI)
General Information:
IEMT is the leading technical conference on electronics manufacturing.
SEMICON/SouthWest 96 is the largest trade show in the Southwest for
semiconductor manufacturing equipment, materials, and services.
This year, IEMT meets concurrently with SEMICON/SouthWest 96. Plan now to
attend both the show and the technical conference and optimize your travel
costs. The international exposition features:
-Over 600 suppliers
-Education programs on key marketing and business needs
-International Standards Meetings
Registration for both events will be handled by SEMI. Advance
registration catalogs will be available in July.
REGISTRATION: On-line registration starts August 1.
CATALOG: To receive a catalog, call 415-940-6903,fax 415-967-5375,
WEB SITE: www.semi.org.
Sessions
* Flip Chip Developments
Chair: Lakhi Goenka, Ford Motor
Co-Chair: Lee Hong Ng, Hewlett Packard
* Cycle Time Management for Semiconductor Manufacturing
Chair: Reha Uzoy, Purdue
Co-Chair: Jim Steele, Motorola
* Semiconductor Packaging: BGA
Chair: Bob Munroe, Motorola
Co-Chair: Mike McShane, Motorola
* Integrated Design, Manufacturing and Cost Modeling
Chair: Daren Dance, Wright,Williams,& Kelly
Co-Chair: Walt Trybula, SEMATECH
* High Density Substrates & Interconnects
Chair: Michel Salagoity, Solectron
Co-Chair: Robert Crowley, TechSearch, Int'l
* Semiconductor Processing
Chair: Jim Steele, Motorola
Co-Chair: Don Millard, RPI
* Environmentally Conscious Manufacturing
Chair: Kam Yeung, Lucent Tech.
Co-Chair: Greg Pitts, MCC
* Assembly and Reliability
Chair: Spike Narayan, IBM
Co-Chair: Tom Chung, Tandem/MCC
* Manufacturing Management
Chair: Walt Trybula, SEMATECH
Co-Chair: Kevin Tilley, Loughborough Univ.
* Process Modeling
Chair: Hua Harry Li, Texas Tech Univ.
Co-Chair: Ken Keys, Ferris State Univ.
* Ultra-Small Packages: CSP, LOC, 3-D
Chair: Hassan Hashemi, AMD
Co-Chair: Marcos Garciaacosta, Adflex
* Product and Process Quality
Chair: Subash Singhal, Lucent Tech.
Co-Chair: Achyuta Achari, Ford Motor
* Large Area / Semiconductor Process Control
Chair: Albert Hu, San Jose State Univ.
Co-Chair: Jerry Stefani, Texas Instruments
Registration Information (This is not a registration form)
This registration information is provided to assist you with planning and
travel authorizations. Registration for both events will be handled by
SEMI. Advance registration catalogs will be available in July. On-line
registration starts August 1. To receive a catalog, call 415-940-6903, fax
415-967-5375, or visit the SEMI web site www.semi.org.
by 9-16 after 9-16
IEEE/SEMI Member 350 450
Non-member 400 450
Speaker, session chair, committee 200 250
Full-time student 75
One day (incl proceedings) 175
Add'l Monday lunches: 25
Add'l Proceedings: 50
Save $50 - $100
Hotel Information
Many hotels offer discount rates to attendees. Call 1.800.545.7364 or
408-282-1582 and ask for information about SEMICON/SouthWest 96 hotels.
The Austin Convention Center--A First Class Facility
The Austin Convention Center is only 15 minutes away from Austin
International Airport and just one block off I-35 - the main artery
connecting Austin to Dallas and San Antonio. More than 3,000 hotel rooms
are within walking distance from the Austin Convention Center.
See It All on One Travel Authorization
Program Committee
Achyuta Achari, Ford Motor
Michael Cassidy, Lucent Tech.
Harry Charles, Jr., Johns Hopkins Univ.
Mona Chopra, Motorola
Tom Chung, Tandem/MCC
Robert Crowley, TechSearch, Int'l
Daren Dance, Wright, Williams, & Kelly
Marcos Garciaacosta, Adflex
Ronald Gedney, IBM (ret)
Lakhi Goenka, Ford Motor
Thomas Goodman, TechSearch, Int'l
Hassan Hashemi, AMD
Albert Hu, San Jose State Univ.
L. Ken Keys, Ferris State Univ.
Young-Gon Kim, LG Semicon
John Konopka, SEMATECH
Hua Harry Li, Texas Tech Univ.
Linda Matthew, LSI Logic
Mike McShane, Motorola
Don Millard, RPI
Bob Munroe, Motorola
Spike Narayan, IBM
Lee Hong Ng, Hewlett Packard
Dennis Olsen, Motorola
Greg Pitts, MCC
Michel Salagoity, Solectron
Wyckhum Seelig, Lucent Tech.
Subash Singhal, Lucent Tech.
Jim Steele, Motorola
Jerry Stefani, Texas Instruments
Patrick Thompson, Motorola
Kevin Tilley, Loughborough Univ.
Walt Trybula, SEMATECH
Reha Uzsoy, Purdue
E. Jan Vardaman, TechSearch, Int'l
Paul Wesling, Tandem Computers
C.P. Wong, Georgia Tech.
Kam Yeung, Lucent Tech.
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4th International Workshop on
Symbolic Methods and Applications to Circuit Design
October 10-11, 1996
Dept. Elektrotechniek, ESAT-MICAS
Katholieke Universiteit Leuven
Leuven, Belgium
Submitted by: Piet Wambacq
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Sponsored by:
* ISHM - The Microelectronics Society
* IEEE Components, Packaging, and Manufacturing Technology Society
* IEEE Microwave Theory and Techniques Society
* National Institute of Standards and Technology (U.S.A.)
INFORMATION:
Symbolic methods for the analysis and design of electronic circuits have
been the subject of steadily growing interest over the past years.
Progress in methodologies and new algorithms, and increasing efforts in
computer implementation have led to more usable software. On the other
hand, the fast evolution of the CAD domain, and the renewed interest in
analog circuit design and design automation, has put new light on the
symbolic approaches.
In Europe, a growing number of teams are involved in research on symbolic
simulation and applications to circuit design. Since 1991 the bi-annual
International Workshop on Symbolic Methods and Applications to Circuit
Design (SMACD) has been organized as a forum for exchange of new ideas
and advances in the field of symbolic circuit analysis and its
applications. Following successful workshops in Bagneux (France - 1991),
Firenze (Italy - 1992), and Sevilla (Spain - 1994), the 4th edition will be
organized in Leuven (Belgium) on October 10-11, 1996.
The workshop is endorsed by IEEE and ECS.
In addition, a selection of papers will be considered for a special issue
of the IEEE Transactions on Circuits and Systems, part II.
Topics of interest (Submission deadline has passed)
- recent advances in symbolic analysis techniques, design tools, and
methods
- algorithms from computer algebra and graph theory applicable
to symbolic circuit analysis
- realizations of symbolic simulators for analog and digital circuits,
including demonstrations
- new methods of circuit design and design automation that make use of
symbolic techniques
- innovative applications of symbolic analysis
For information, contat:
Danielle Vermetten, SMACD'96 Secretariat
Department Elektrotechniek, ESAT-MICAS
Katholieke Universiteit Leuven
Kardinaal Mercierlaan 94
B-3001 Heverlee
Belgium
Tel : ++32-16-321077
Fax : ++32-16-321975
E-mail: smacd96@esat.kuleuven.ac.be
ORGANIZING COMMITTEE
Prof. G. Gielen
Prof. W. Sansen
Dr. P. Wambacq
Katholieke Universiteit Leuven, Belgium
SCIENTIFIC COMMITTEE
Dr. M. Berger, Bosch, Germany
Prof. F. Fernandez, CNM - Sevilla, Spain
Prof. G. Gielen, Katholieke Universiteit Leuven, Belgium
Prof. M Hassoun, Iowa State University, U.S.A.
Prof. E.-H. Horneber, University of Braunschweig, Germany
Dr. A. Konczykowska, CNET, France
Prof. A. Liberatore, University of Firenze, Italy
Prof. S. Manetti, University of Firenze, Italy
Dr. R. Sommer, University of Kaiserslautern, Germany
Dr. P. Wambacq, Katholieke Universiteit Leuven, Belgium
Dr. Q. Yu, Crystal Semiconductors, U.S.A.
PRELIMINARY REGISTRATION FORM
I wish to attend the SMACD'96 Workshop. Please, send program and
application form when available.
Name:
Mailing address:
Phone:
Fax:
E-mail:
Please complete and return to
SMACD'96 Secretariat (attn Danielle Vermetten)
Department Elektrotechniek, ESAT-MICAS
Katholieke Universiteit Leuven
Kardinaal Mercierlaan 94
B-3001 Heverlee
Belgium
or by e-mail to : smacd96@esat.kuleuven.ac.be
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SHORT CONFERENCE/MEETING NOTICES
August 12-14, 1996: 1996 Int'l Symp. on Low-Power Electronics and Design
Monterey, CA. (408)296-6883 (sigda@nextwave.com)
August 21-23, 1996: Advanced Workshop on Wireless Communications
Boulder, Colorado, USA. Janet Kingston (703-758-1060)
Sept. 8-12, 1996: Surface Mount International '96
San Jose, CA USA. (214) 239-3060
Sept. 16-18, 1996: Annual Connector Symp. and Trade Show.
Boston, MA USA. (908) 233-7278
Sept. 16-20, 1996: 1996 Holm Conference
Chicago, Illinois USA. Gerald Witter (847-244-6025)
Sept. 17-18, 1996: Canadian High Technology Show.
Toronto, Ontario, CANADA. (203) 840-5443
Sept. 18-19, 1996: Int'l Flotherm User Conference.
Paris, FRANCE. 44 (0) 181 941 8810
Sept. 24-26, 1996: Assembly Technology Expo
Rosemont, Illinois, USA. (847) 260-9700
Sept. 29 - Oct 2, 1996: 1996 Annual IEPS Conf.
Austin, TX USA. (612)922-1988
Oct. 2 - Oct 4, 1996: IEEE Int'l Symp. on Semiconductor Manufacturing (ISSM)
Tokyo, JAPAN. Contact: Tadahiro Ohmi; c/o Ultra Clean Soc,;
Cosmos Hongo Bldg,; 8F 4-1-4, Hongo, Bunkyo, Tokyo, 113 JAPAN.
Oct. 6-10: ISHM Symposium.
Minneapolis, MN USA. (703) 471-0066
Oct. 8-11, 1996: Elenex Australia '96
Melbourne, AUSTRALIA. (In USA, 301 656 2942)
Oct. 9-11, 1996: IEEE Int'l Conf. Innovative Systems in Silicon (ISIS)
Austin, TX. skt@msrc.wvu.edu (
Oct. 9-12, 1996: Globaltronics
SINGAPORE. (In USA, 203-840-5443)
Oct. 14-16, 1996: 1996 Int'l Electronics Manufacturing Technologies Symp.
Austin, TX. Jan Vardaman (512-343-4508)
Oct. 16-18, 1996: BGA/Flip Chip Packaging Workshop.
Binghamton, NY. Ron Gedney (607-770-8886).
Oct. 17-18, 1996: IEEE CPMT Workshop on Accelerated Stress Testing.
Ottawa Canada. H. Anthony Chan (609-639-2420).
Oct. 22-24, 1996: Wescon '96
Anaheim, CA USA. (310)215-3976
Oct. 28-30, 1996: 5th Topical Meeting on Electrical Performance of Electronic
Packaging (EDEP'96)
Napa, CA USA. Paul Baltes (520-621-3054)
Nov. 4-6, 1996: Northcon '96
Seattle, WA USA. (310)215-3976
Nov. 12-14, 1996: IEEE/SEMI Advanced Semiconductor Manufacturing Conference
Cambridge, MA USA. Margaret Kindling (202-289-0440).
Nov. 18-20, 1996: Workshop on Smart Card Technologies and Applications
Berlin, Germany. Dr. Elke Azkel (49 30 464 03162).
Nov. 18-22, 1996: Comdex Fall Show
Las Vegas, NV USA (617)449-6600
Dec. 9-12, 1996: 2nd Int'l Symp. on Electronic Packaging Technology
Shanghai, China. fhliu@fudan.ihep.ac.cn or sliu@eng.wayne.edu.
Jan. 27-29, 1997: Recent Progress in Printed Circuit Board Technology
Berlin Germany. Dr. Elke Azkel (49 30 464 03162).
Feb. 3-5, 1997: IEEE Multi-Chip Module Conference
Santa Cruz, CA USA. Linda Pascal (408 459 2263).
March 10-12, 1997: 3rd Int'l Symp. on Advance Packaging Materials: Processes
Properties, and Interfaces
Chateau Elan, Braselton, GA USA. ISHM (703-758-1060).
Apr 16-18, 1997: 1997 IEMT/IMC Joint Symposium
Omiya Sonic City, JAPAN. IEMT/IMC Symp. Sec. (81 3 5802 5366).
June 15-19, 1997: INTERpack '97. The Pacific Rim/ASME Int'l Intersociety
Electronic and Photonics Packaing Conf.
Hawaii USA. Dr. Ephraim Suhir (908 582 5301).
Return to Index
To submit web sites (including yours) for
addition to the list, feel free to email them to pkg_news@msrc.wvu.edu.
In this case, you can provide a summary of the activities of the
company/group represented by the web site.
Full List of Web Sites will
be at this location
- Amkor Electronics, Inc.
- Advanced Interconnections, Inc.
Sockets.
- Amtech, Inc.
SMT solder creams, solder powder.
- Asymtek, Inc.
Dispensing systems (e.g., flip-chip underfill and wire-bond encapsulation.
- Broome Engineering.
- Desco.
Switching power supplies.
- Digi-Key Corp.
General electronics components and supplies.
- Diversified Systems, Inc.
Bare board prototyping.
- Dynatronix, Inc.
- Electrovert USA Corp.
Reflow ovens and other equipment.
- Flomerics, Inc.
Reflow ovens and other equipment.
- Fluid Dymanics International Inc.
- Fuji America Corp.
PCB fabrication equipment.
- Kester Solder.
- Lumonics, Inc.
- Melcor, Inc.
- Perfection Products, Inc.
- Plastic Systems.
- Poco Graphite, Inc.
- Qualitek International, Inc.
- Signatone Corp.
- Spectrum Semiconductor
Materials.
- SC Technologies (formery StatiCon
Inc).
Static control products
- TDK Corp. of Chicago.
Assembly systems
- Thermalloy, Inc.
- Universal, Inc.
Return to Index
The following books were reviewed in the July, 1996 issue of Electronic
Packaging and Production. Unfortunately, publishers were not listed.
Pulishers are given below in those cases where the publisher was visible
on the image of the book cover.
- Doug Peck, Mastering and Implementing BGA Technology,
Publisher: Advanced Electronics Interconnect Center, Inc.
Publication date: 1995. Price $149.95
- John Lau, Flip Chip Technologies,
Publisher: SMT Plus, Inc.
Publication date: 1996. Price $79.95
- James Blankenhorn, BGA,COB and Flip Chip PCB Design,
Publication date: 1996. Price $179.95 (?)
- Joseph Fjelstad, Flexible Circuit Technology,
Publication date: 1994. Price $39.95
- John Lau, Professional SMT Component and Layout Pattern Book,
Publisher: SMT Plus, Inc.
Publication date: Published annually.
- 1995: 7th Edition. $299.95
- 1996: 8th Edition. (available Sept. 1996)
- Masakazu Shoji, High-Speed Digital Circuits,
VLSI and integrated circuit design, including role of interconnects
Publication date: 1994. 360 pages. Price $53.75
Return to Index
Return to Books Index Item
Submitted by Paul Wesling:
Table of
Contents for upcoming/current issues of the IEEE Trans. on Advanced
Packaging. Each quarter, this location will be updated with the next Table of
Contents.
For information on subscribing to this quarterly journal (800 pages/year;
about 100 papers), call IEEE (in the USA tollfree at 1-800-678-IEEE) and
ask for publication 021-1651. Subscriptions are $250/year (non-IEEE
members). You may wish to join IEEE (members get substantial discounts);
if so, request information from IEEE or contact p.wesling@ieee.org for
information.
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