The following list is largely for Web sites related to electronics packaging
(either components or equipment). In the event that errors are found, please
relay such information directly to skt@msrc.wvu.edu, with the "subject" portion
of the email stating "Electronic Packaging Newsletter Web Site List".
To submit web sites (including yours) for
addition to the list, feel free to email them to skt@msrc.wvu.edu.
In this case, you can provide a summary of the activities of the
company/group represented by the web site.
MicroModule Systems. Micromodule Systems is a leading manufacturer of high
density thin film interconnect and packaging products. They also design and build die-and-wafer-level test
and burn-in products. Advanced packaging technologies are used to produce a line of miniaturized
Pentium(r) processor-based modules for "Xtreme Mobile Computing(tm)" applications.
Microsim Corp.
Cad tools for electronics ("PSPICE", pcb design, etc).
Yamaichi Electronics USA Inc.
Test contactors, burn-in sockets, emulation and prototyping sockets,
production sockets. known good die & chip scale packaging.